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Creaform announced today the latest upgrade to its scan-to-CAD software module. Part of VXelements, Creaform’s 3D software platform and application suite, VXmodel features a new collaborative functionality for direct transfer to Dassault Systèmes SOLIDWORKS and streamlined workflows for reverse engineering and additive manufacturing in scan-to-CAD to print. “VXmodel provides engineers with a simple, yet powerful, software solution that significantly accelerates reverse engineering process time. It now fulfills its duty as an integrated bridge for scan-to-CAD processes more than ever,” said Simon Côté, Product Manager. Here are some of the improvements added in this upcoming release of VXmodel: Direct transfer to SOLIDWORKS: Thanks to the “Direct transfer to SOLIDWORKS” function, all the essential information needed for your reverse engineering process such as NURBS surfaces, cross-sections and geometrical entities are automatically transferred into the CAD software in a single click! Texture menu: The Go!SCAN 3D color acquisition is now supported. Reapply the texture from a scan acquisition to the clean mesh

At its 2015 user conference, COMSOL has revealed features for Multiphysics 5.2. This release, according to the company, has updates for improved stability, robustness and execution. Features have also been added for easier application editing and overall user experience. To learn more about how the COMSOL Application Builder democratizes simulation, download a benchmarking study produced by Desktop Engineering and sponsored by Intel, Dell and COMSOL. Version 5.2 has an enhanced Application Builder with new editor tools for quicker creation of user interface components, a press release states. Tools enable users to make any model parameter, physics setting or plot into a user interface. Graphics can also be updated while the application is running with the App Designer. For the COMSOL Server, 5.2 has a new caching function lets users start applications quicker and simplify administration tasks. Application Libraries have also been expanded to include approximately 50 example simulations in areas such as membrane dialysis to water treatment,

Bentley Systems, Incorporated announced that Leica Geosystems will incorporate Bentley’s Acute3D reality modeling software into its advanced oblique airborne imaging solutions for both unmanned aerial vehicles (UAVs) and piloted aircraft. Leica Geosystems, a leader in geospatial data acquisition and mapping products, has selected Acute3Dsoftware to generate full 3D “reality mesh” representations from its airborne photogrammetric imagery. This combination of software and hardware advancements will enable users to take full advantage of integrated 3D surveying and mapping. Through reality modeling, observations of existing conditions are processed into representations for contextual alignment – for instance, within design modeling and construction modeling environments, in addition to mapping. Rather than generating a voluminous cloud of discrete points, Acute3D produces a 3D reality mesh, readily aligning the real-world context in mapping and infrastructure applications. “Acute3D’s breakthrough capabilities make it possible to now produce true 3D models, even in engineering formats, directly from digital photography, with unlimited scalability,” Styli Camateros, Bentley Systems senior

Aras® today announced that Laird, a leading global manufacturer of systems that enable communications connectivity and protect electronics from electromagnetic interference and heat, has selected the Aras Innovator® platform to streamline global product development and improve product visibility. Integrating to NX and Solidworks CAD, Altium ECAD, and the Laird ERP system, Aras Innovator will unify Laird’s product development, change management, and project management processes across seven business units worldwide. Working with Aras Gold Certified Partner Razorleaf, Laird selected Aras Innovator for the platform’s flexibility to meet the distinct configuration needs of each business unit. PLM system flexibility is vital to Laird, as the company develops a broad range of mission-critical systems, components, and solutions for customers in multiple industries from over 50 facilities in 19 countries across the globe. “Laird has provided global organizations with high-quality performance materials and wireless systems for more than 30 years,” said Peter Schroer, CEO of Aras. “Their

WHO: The international EDA Consortium (EDAC), provider of services, market awareness and a common voice for EDA and IP suppliers to the global semiconductor industry, and its Emerging Companies Committee WHAT: Will host a panel titled, "Patents and Patent Litigation -- Develop, Strengthen, and Protect Your Intellectual Property," featuring John Cabeca, newly named director of the Silicon Valley United States Patent and Trademark Office. Opening remarks will be made by San Jose's Mayor Sam Liccardo. WHEN: Thursday, October 29, from 6 p.m. until 9 p.m. WHERE: EDA Consortium/SEMI Global Headquarters, 3081 Zanker Road, San Jose, Calif. Moderated by Salumeh Loesch, an associate with Klarquist Sparkman, panelists will include John Cabeca, Karna Nisewaner, associate general counsel at Cadence Design Systems, Robert Sachs, partner with Fenwick & West, and John Vandenberg, partner at Klarquist Sparkman. They will address how to get highly technical patents through the Patent Office, and offer advice about how to protect patents or potential inventions in the current

Siemens announced an expanded partnership with Georgia Institute of Technology (Georgia Tech), building upon a nearly two-decade relationship pursuing manufacturing innovation through software, conducting frontier-pushing research that supports digital product development, and preparing students to enter the science, technology, engineering and mathematics (STEM) workforce of the future.  “Georgia Tech is one of the leading research institutions in this country, paving the way for new ideas and technologies to help redefine the way we manufacture goods, power our homes, travel through space and more,” said Eric Spiegel, president and CEO, Siemens USA. “Building upon our strong relationship, this comprehensive partnership will continue to produce cutting-edge research and innovative industrial automation and digitalization software, while preparing highly trained students to join the global manufacturing workforce.” This full spectrum partnership will continue to push the boundaries of advanced manufacturing design, automation and innovation. One example where this vision is currently being realized is the Georgia

In cooperation with TraceParts, Rollon is now making their 2D and 3D CAD data available for free download.  Rollon, one of the technological leaders in linear motion systems, including telescopic guides, linear guides and actuators, has always focused on delivering first class technical support to engineers in different applications such as industrial machines, railway, aerospace, logistics, special vehicles, packaging or medical. To further enhance its service to design engineers, Rollon has now partnered with TraceParts to offer them instant access to its 2D and 3D drawings and technical data.  The publishing of its 3D catalog fully supports Rollon's global growth strategy which was initiated in 2011 with the acquisition of El.More, a manufacturer of linear actuators and tables. More recently, Rollon made another acquisition in 2015 of Tecno Center also, a specialist in actuators.  "The decision to work with TraceParts was a way to support our growth worldwide. Publishing our CAD data with

Nano-electronics research center imec and Cadence Design Systems, Inc.today announced that the companies completed the first tapeout of a 5nm test chip using extreme ultraviolet (EUV) as well as 193 immersion (193i) lithography. To produce this test chip, imec and Cadence optimized design rules, libraries and place-and-route technology to obtain optimal power, performance and area (PPA) scaling via Cadence® Innovus™ Implementation System. Using a processor design, imec and Cadence successfully taped out a set of designs using EUV lithography as well as Self-Aligned Quadruple Patterning (SAQP) for 193i lithography, where metal pitches were scaled from the nominal 32nm pitch down to 24nm to push the limit of patterning. The Innovus Implementation System is a next-generation physical implementation solution that enables system-on-chip (SoC) developers to deliver designs with best-in-class PPA while accelerating time to market. Driven by a massively parallel architecture with breakthrough optimization technologies, the Innovus Implementation System provides typically 10 to

Cadence Design Systems announced the new Cadence Tensilica Vision P5 digital signal processor (DSP), its flagship high-performance vision/imaging DSP core. This imaging and vision DSP core offers up to 13X performance boost, with an average of 5X less energy usage on vision tasks compared to the previous generation IVP-EP imaging and video DSP. The Tensilica Vision P5 DSP is built from the ground up for applications requiring ultra-high memory and operation parallelism to support complex vision processing at high resolution and high frame rates. As such, it is ideal for off-loading vision and imaging functions from the main CPU to increase throughput and reduce power. End-user applications that can benefit from the DSP’s capabilities include image and video enhancement, stereo and 3D imaging, depth map processing, robotic vision, face detection and authentication, augmented reality, object tracking, object avoidance and advanced noise reduction. The Tensilica Vision P5 DSP core includes a significantly expanded

Rand Worldwide today announces that itsIMAGINiT  Technologies division is releasing a new addition to the IMAGINiT Clarity family of products – Clarity Owner Data Portal (ODP). Clarity ODP combines the popular benefits of Clarity with powerful tools for organizations to distribute data to non-Revit users and integrate with enterprise facilities management software systems including ARCHIBUS. “The findings from our recent ‘Insights into BIM and FM’ survey clearly pointed to a gap that needs to be bridged between BIM and facilities management,” says Joe Eichenseer, director of the Building Lifecycle Solutions team at IMAGINiT. “More than half of the building owners surveyed did not know how to mine critical data from their building information model. And only 27 percent of AEC firms knew what type of BIM information would be useful for owners and facility managers. Clarity Owner Data Portal addresses this disconnect by allowing owners to query the model and extract useful data that