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SAE Industry Technologies Consortia (ITC), an SAE International affiliate, announces the creation of the Defense Automotive Technologies Consortium (DATC). SAE ITC was selected by the U.S. Army Tank Automotive Research, Development and Engineering Center (TARDEC) to create an “other transaction agreement (OTA)” to quickly and efficiently integrate innovative automotive technologies into military ground vehicles, ultimately resulting in speed of adoption of commercial technologies and improved defense capabilities. “SAE has a long history of supporting the U.S. Army, dating back to World War I when our members designed and manufactured the crucial Class B Truck in just 69 days for the war effort,” David L. Schutt, PhD, President of DATC and Chief Executive Officer of SAE International, said. “We are pleased and honored to continue that support through the work of DATC. Helping to expedite the adoption of innovative technologies will greatly assist our nation’s defense capabilities.” DATC, is a nonprofit incorporated in Michigan

HP Inc. today kicks off a week-long celebration of the 50th Anniversary of HP Labs, the company's advanced research center dedicated to developing technology. Guided by visionaries in technology and social science, HP Labs is fueling engineering innovation in 3D printing, immersive computing, hyper mobility, Internet of Things, microfluidics and more. To celebrate the Labs' founding in 1966, HP will host a livestreamed event via HP's Digital Newsroom, News@HP, at 6 pm PDT Tuesday, September 27. Dion Weisler, HP President and CEO, and Shane Wall, Chief Technology Officer and Head of HP Labs, will discuss the company's rich heritage and outline how HP is driving the next 50 years of innovation. Everyone, everywhere can virtually experience #Next50inTech events via News@HP, HP News on Periscope and Snapchat. HP also will livestream a panel on how diversity is key to driving future innovation, hosted by Leena Rao from Fortune, Tracy Keogh, HP Chief Human Resources Officer, Stacy Brown Philpot, HP Board Member and TaskRabbit CEO, and Aida Alvarez, HP

Cognizant today announced that it will establish a Cognizant Digital Works Collaboratory in Melbourne, Australia. The Collaboratory will provide dedicated space for open collaboration among Cognizant, customers, and partners to design, prototype, and build digital solutions of the future. The announcement was made following the visit of Philip Dalidakis, Minister for Small Business, Innovation and Trade, Government of Victoria, to New York City. Using the Collaboratory and its proven Accelerator Methodology, Cognizant will further enhance and extend its digital business transformation capabilities to help customers manage innovation and build solutions for the digital economy. The Collaboratory will include a showcase of new technologies in action, a fabrication space for prototyping, tools for "making" and collaboration, and supporting technologies for mobile and Internet of Things solutions. Interdisciplinary teams of strategists, designers, technologists, data scientists, and human sciences experts will work in the Collaboratory side-by-side with customers and partners to reimagine business and explore the art of

A tipping point refers to a point in time where change self-propagates, leading to rapid transformation. The concept first moved into popular culture when Malcolm Gladwell published The Tipping Point in 2000. At a deeper level, tipping points are related to a subset of complexity theory known as bifurcation analysis. What’s fascinating about this concept is that it is relevant to a wide range of applications, encompassing everything from the behavior of crowds to engineered systems. What, you might ask, does this have to do with smart facilities? I believe that we are reaching a tipping point beyond which the tools and practices commonly used today in AEC and EPC will no longer be able to cope with the complexity of new building, process plant, and infrastructure projects. Advanced facilities today don’t merely contain systems—they contain systems of systems—and it is becoming difficult with current AEC and EPC techniques to predict

Renesas Electronics Corporation today announced a contactless wireless charging solution for low-power applications, such as hearing aids and other wearable devices that require resistance to water and dust. The new wireless charging solution consists of a power receiver integrated circuit (IC) (RAA457100) and a power transmitter IC (RAA458100). Each IC includes all functions needed for wireless charging on a single chip. Renesas will also offer an evaluation kit to help manufacturers with their wireless charging designs. Wireless charging technology eliminates the need to change batteries or connect a power cable. This convenience has wide appeal for a variety of applications, such as smartphones and wearable devices. Wireless charging technology is of particular interest in low-power applications such as hearing aids that require small form factors as well as resistance to water and dust. However, existing wireless charging technologies have been considered unsuitable for charging systems employing compact lithium-ion (Li-ion) secondary

A new version of the Dimensional Measuring Interface Standard (DMIS) version 5.3 has been approved as an American National Standard by ANSI (American National Standards Institute). Under the auspices of the Dimensional Metrology Standard Consortium (DMSC, Inc.) this new version of DMIS contains all capabilities of previous versions of DMIS, as well as corrected errors, recent updates, and new enhancements.  DMIS 5.3 is a more comprehensive standard representing a response to user requests, industry needs, and technology advances in the field of Metrology.  Although there are many commercial products based upon DMIS, it is not a commercial software product.  DMIS is an American National Standard as well as an ISO Standard.  DMIS defines a neutral language format for communication between information systems and dimensional measurement equipment (DME), and it is very likely the most widely used metrology standard in the world today.  DMIS can perform as an execution language for measurement part

Dassault Systèmes today announced the launch of “Perfect Order,” an industry solution experience for natural resources that helps mining companies improve supply chain efficiency and profitability.  “Perfect Order” offers digital end-to-end supply chain management capabilities for more visibility, control and predictability across operations. As mining companies strive to deliver commodity shipments to customers that are on time and meet quality specifications, an efficient and cost-effective supply chain is critical.  However, lower commodity prices, more variable demand, and lower grade deposits are increasing supply chain complexity, making it harder for mining companies to meet customer contract requirements. Based on the 3DEXPERIENCE platform and leveraging Quintiq supply chain planning and optimization capabilities, Dassault Systèmes’ “Perfect Order” industry solution experience offers mining companies a holistic view of what’s occurring throughout the supply chain, from infrastructure constraints and bottlenecks, to labor shortages or the financial impact of an operational change.  In a digital environment, companies

Mentor Graphics Corporation today announced that Siemens Building Technologies has deployed Mentor's SystemVision® product with Siemens printed circuit board to (PCB) design teams around the world, providing an upfront, mechatronic simulation environment and a qualified, central library for the Mentor Graphics® Xpedition® Enterprise PCB design flow. Early simulation using the SystemVision tool allows designers to make design decisions regarding component tradeoffs, find design mistakes, and verify their designs before PCB layout. The central library allows teams to exchange projects around the world, which eliminates errors due to using different libraries and tools for simulation and PCB layout. The SystemVision multi-discipline collaboration environment lets designers at Siemens Building Technologies explore concepts, validate performance specifications, and investigate architectures of systems developed for modern, energy-efficient building systems. These systems are comprised of electrical (analog, digital, and mixed-signal), mechanical, embedded software, and controls. Teams from Switzerland, France, China, and the United States save valuable design time by validating electrical

Aras® today announced Ingalls Shipbuilding, a division of Huntington Ingalls Industries – America’s largest military shipbuilding company, has selected the Aras Innovator® platform to support the complex engineering processes in the development of the company’s technologically advanced warships for the U.S. Navy, and the U.S. Coast Guard. Ingalls Shipbuilding selected Aras to streamline and standardize processes on a single platform and remove the bottlenecks that occur because of numerous stand-alone systems and databases. Aras will be used to better manage models, drawings, parts, technical specifications, structural planning and planning data. The company anticipates more than 3,000 members of its engineering and product development team will use Aras over time. Ingalls Shipbuilding will use Aras Innovator to improve the following key areas: Concurrent Engineering – Ability to proceed with engineering the design of the ship while a model is out for planning and configuration management Configuration Management – Full configuration & change management

Fujitsu Electronics Europe (FEEU) will be attending this year’s electronica in Munich from November 8 to 11, 2016. Under the slogan “Accelerating Global Innovation“, FEEU informs businesses about the current supplier portfolio and range of product linecards, developed by the value added distribution partner for key sectors such as the automotive, industrial, medical & wellness and telecommunication industries. Supplier area at the FEEU booth A strong focus on choosing the right supplier is one key element of the company’s global distribution strategy. Solutions which are not included within the FEEU portfolio can still be delivered through the company’s network of manufacturers. To showcase a significant subset of its line card FEEU will set up a supplier area at this year’s electronica and a range of suppliers will be in attendance. “The world’s largest trade fair for the electronics industry is a must for us as a value added distribution partner,”