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Dassault Systèmes presents the Italian edition of 3DEXPERIENCE Forum 2016, “Doing Business in the Age of Experience,” to be held October 13 at Talent Garden in Milan.  The event will focus on the proposition of groundbreaking innovation strategies to the Italian business community and will showcase a content-rich agenda, where speeches by Dassault Systèmes’ Global and Geo leaders will alternate with presentations by major European and Italian customers from different industries. Participants will also be involved in a number of roundtable discussions, industry-specific tracks, hands-on sessions and a renovated interactive Playground.  In the morning, attendees will learn how the Age of Experience is changing the global business model and will discover extraordinary stories of innovation. Top brands including Alstom, Claas, Elaphe, Elettra Sincrotrone, Maschio Gaspardo, MBDA, Pirelli and TOD’s will explain how they are consolidating their leadership by creating unique experiences for their own customers and markets, using Dassault Systèmes

TEDxHyderabad will be the second TEDx Event to be presented under the TEDx Anchor Program series and will take place on Sunday, 2 October, at Sandhya Convention by Nimantran, Gachibowli, Hyderabad. This event has been organized with the core narrative revolving around “Crafting Our Future.” A line-up of 13 speakers from varied backgrounds, including technology, has been organized for the day-long program. The TEDx Anchor Program consists of independently organized events that inspire communities to discuss large ideas on a wide range of subjects such as education, health, science, design, technology, entertainment, and more.  To view the original press release, please click here. Search for Infosys on CIMdata.com

Infosys today announced the winners of the first Infy Maker Awards, India. The Infy Maker Awards are testimony to Infosys' commitment to encourage the concept of 'Making' in India, acknowledging those individuals that have an interesting or innovative solution for real-world issues or a knack for leveraging technology to make things easier. These awards were initially launched in the U.S. by the Infosys Foundation USA in June 2015 in support of President Obama's Nation of Makers initiative. Mr. Pravin Rao, Chief Operating Officer, Infosys said, "The Infy Maker Awards in India aim to recognize some of the best minds, and unleash the power of creativity and imagination of the next generation of thinkers. We believe that these awards will ignite the spirit of 'making' in India and celebrate excellence in innovation. Through these awards, we aim to inculcate and foster an ecosystem of forward-thinking makers. Infosys intends to steadily empower and reward such makers in India across communities and organizations." Congratulating the winners on their achievement, Vandana Sikka, Chairperson, Infosys Foundation USA said, "The Infy Maker Awards program celebrates

Materialise NV, HOYA Vision Care Company, and Hoet Design Studio are proud to launch the world’s first vision-centric 3D-tailored eyewear. Yuniku by HOYA enables individualized lens and frame design, with a sophisticated end-to-end digital supply chain that is set to transform the eyewear industry. For the first time ever, both lenses and frames can be designed and positioned to fit an individual’s unique facial features, functional needs, and vision requirements, resulting in an enhanced vision experience, increased comfort, and new possibilities for personalization. “When 3D Printing meets the right application and the right partners, it has the potential to turn around an entire industry,” states Alireza Parandian, Global Business Strategist – Wearables, Materialise. “Materialise has helped this happen before in the hearing aid industry, when our custom software enabled the digital manufacturing of in-ear hearing aids to go from 20% of the total to nearly 100% in just two years. I

Cadence Design Systems, Inc. today announced the immediate availability of an integrated system design solution for TSMC’s advanced wafer-level Integrated Fan-Out (InFO) packaging technology, resulting from a collaboration between Cadence and TSMC that was announced earlier this year. Cadence is now offering implementation, signoff and electro-thermal analysis tools that enable concurrent multi-chip optimization for designs that incorporate InFO. The Cadence solution includes: Cadence System-in-Package (SiP): Provides the InFO design and layout platform with enhanced features to generate the complete layout of the system, in-design design rule checking (DRC), and IC-level physical signoff. Multiple extraction solutions at the chip and package level: The Quantus™ QRC Extraction Solution and Allegro®-Sigrity™ Package Assessment and Extraction Option are specifically tailored for verifying InFO applications. Multiple IC signoff solutions: The Tempus™ Timing Signoff Solution provides cross-die/cross-InFO timing checks, the Voltus™-Sigrity Package Analysis offers multi-die concurrent electro-migration IR drop (EMIR) analysis, and the Cadence Physical Verification System (PVS) provides DRC and layout versus schematic (LVS) checking for InFO systems

Synopsys, Inc. today announced its collaboration with TSMC to deliver innovative technologies to enable adoption of TSMC's High Performance Compute (HPC) Platform. The new technologies, enabled through TSMC and Synopsys collaboration, will be available in the Synopsys' Galaxy™ Design Platform for the 7-nanometer (nm) process in November 2016. Via pillar, multi-source clock tree synthesis (CTS) with hybrid clock mesh and automated bus routing to match resistance and capacitance on critical nets are some examples of the jointly developed technologies. With these innovations, TSMC and Synopsys will enable designers to create cutting-edge, high-performance designs at the 7-nm process node. Via pillar is a new technology that aims to reduce via resistance and increase electromigration robustness for enhanced performance. Via pillar is supported in IC Compiler™ II place and route system, and is enabled for what-if analysis in Design Compiler Graphical®. This includes insertion of via pillars in the netlist, modeling of via

PTC today announced that it has joined the SAP® PartnerEdge® program as a partner that designs, develops and builds software integrated with SAP solutions. Through its participation in the program, PTC is now announcing the availability of its ThingWorx® Internet of Things (IoT) platform running on the SAP HANA® platform. The solution provides customers with essential IoT application development and analytics capabilities as well as innovative augmented reality functionality, powered by Vuforia®. PTC recently launched ThingWorx on the SAP App Center, where it will be marketed toward SAP customers and partners. As an SAP partner, PTC made ThingWorx available using tools and resources available from the SAPPartnerEdge.com web site. “Joining the SAP PartnerEdge program provides PTC with another highly regarded channel for distributing the ThingWorx platform,” said Jim Heppelmann, president and CEO, PTC. “By working with SAP, we are able to extend our leading IoT capabilities to a larger network

3D PDF Consortium is pleased to announce its first Academia Member Category partner. Purdue University is the first university to take advantage of the new Academia member category. The team initiating the drive for consortium membership is headed up by Nathan W. Hartman, Ed.D., the Professor and Associate Head of Computer Graphics Technology at Purdue. The mission of the undergraduate program in Computer Graphics Technology is to prepare graduates for leadership positions in computer graphics professions and to advance the knowledge in the application and teaching of computer graphics through applied research, publishing, presentations, and teaching. This is a great fit for Purdue University and the 3D PDF Consortium. “We joined 3DPDF consortium to interact with those companies and industry sectors leveraging PDF technology throughout the product and process lifecycle. The contacts and knowledge gained will influence our curriculum at Purdue,” said Professor Nathan W. Hartman, Ed.D., Professor and Associate Head, Computer Graphics

 PDF Key takeaways: Over the last year, Autodesk invested heavily in building out their Product Innovation Platform, extending the Fusion brand to current and new offerings Autodesk announced Cloud PDM for MCAD data management, available now for current Fusion Lifecycle subscribers at no additional cost Their recent acquisitions, Configure One (now Fusion Configure) and SeeControl (now Fusion Connect), are being rapidly integrated into existing and new workflows to support the development of highly configured and increasingly smart, connected products Autodesk held their third annual Accelerate event in Boston’s Seaport District on 15-16 September 2016. Nearly 300 people attended, including many PLM 360, or Fusion Lifecycle, customers, as Autodesk has branded it since the last event.[1] At last year’s Accelerate, Autodesk positioned Fusion 360, their cloud-based MCAD solution, at the center of their product innovation platform (PIP), a rethinking of the product development environment that CIMdata (and others) have promoted for the last few years. The Autodesk

ESI Group launches the latest version of its Virtual Reality solution IC.IDO 10.2. In this new version, ESI has strengthened its solution with the new modules IDO.SolidMechanics and IDO.Elastic, while significantly improving pre-existing modules. Benefiting from ESI’s unique knowledge of material physics, the two new modules are based on a novel physical simulation solver, which provides unprecedented fidelity of real-time behavior for rigid and elastic parts. Among the many solutions available on the market, ESI IC.IDO excels at providing a Virtual Reality solution tailored to industrial needs. In particular, IC.IDO features models in real-scale and real-time. Its unequalled capacity to integrate material physics make it a powerful collaborative tool that is used by leading industry players across many industrial sectors, including Audi AG, Bausch & Stroebel, Boeing, Bombardier, Caterpillar, Ford, Gabler, MAN, Mitsubishi Hitachi Power Systems Europe, Renault, Trumpf, and more. The IDO.Elastic module extends IDO.SolidMechanics with simulation of 1D elastic components, including cables and hoses. Based on IDO.SolidMechanics’ solver, IDO.Elastic predicts in real-time the dynamic behavior of