Siemens, a leading technology company, announced that Toshiba Electronic Devices & Storage Corporation (“Toshiba”) has introduced Siemens’ electronic design automation (EDA) software to enhance its power devices and analog semiconductor development capabilities. With this move, Toshiba aims to strengthen its position as a leader in semiconductor innovation and accelerates the development of next-generation power devices and analog semiconductors that meet the highest standards of performance and reliability.
“Toshiba has introduced Siemens’ EDA tools to advance semiconductor design sophistication and accelerate development speed and we have begun trials to strengthen our design environment using these tools, aiming to improve design accuracy in analog–digital co-design, streamline verification processes, and improving development workflows,” said Yoshinari Ojima, Senior Manager of Toshiba’s Design Engineering Development Department, IC Development Center. “Through these efforts, we will further reinforce the quality and reliability we have already established, not only in power devices and analog semiconductors but also in digital and mixed-signal semiconductors. Building on our long-cultivated proprietary technological expertise, Toshiba will drive innovative semiconductor development that meets market needs through collaboration with these EDA tools.”
“We are delighted that Toshiba has introduced a broad range of our EDA software for its power device and analog semiconductor development design flows,” said Yukio Tsuchida, vice president for Japan, Siemens EDA, Siemens Digital Industries Software. “We look forward to supporting Toshiba on its journey to enhanced design excellence and to help it to deliver transformational change in its design processes with the power, precision and performance of Siemens’ EDA technology.”
Toshiba’s deployment of Siemens’ world class EDA tools includes:
Advanced thermal design and analysis for 3D IC architectures
Toshiba has introduced Siemens’ advanced technologies to address thermal challenges unique to 3D IC architectures. The company is currently utilizing the Innovator3D IC™ solution suite, which enables efficient creation, simulation, and management of heterogeneously integrated 2.5D/3D IC designs, along with Calibre® 3DThermal software to consider establishing an integrated chip-package thermal co-design flow that spans from early feasibility analysis through to final sign-off. Through these initiatives, Toshiba aims to optimize package design and further enhance product reliability with precise thermal modeling.
Power optimization, integrity and reliability enhancement
Using Siemens’ Insight Analyzer and mPower™ Analog EMIR software, Toshiba plans to conduct advanced leakage current optimization, precise Electromigration and IR-drop (EMIR) verification, and enhanced power efficiency validation, all of which improves device reliability. Toshiba will also use Siemens’ PowerPro™ Designer software earlier in the flow to analyze and optimize its RTL to minimize power consumption.
Next-generation analog simulation acceleration
Toshiba is leveraging Siemens’ Solido™ Simulation Suite to work toward improving the efficiency of analog and mixed-signal design verification and enhance the accuracy of simulation work. In addition, Toshiba is utilizing the AI capabilities of Siemens’ Solido™ Design Environment software to perform variation simulations and advanced statistical analyses, with the goal of strengthening the overall robustness of its designs.
