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Accenture reported financial results for the fourth quarter and full fiscal year ended August 31, 2024. Click to download the 4Q FY24 and Full FY24 earnings infographics. To view the original press release, please click here. Search for Accenture on CIMdata.com

The expansion of CONTACT’s PLM module for variant management makes it even easier for companies to standardize their product portfolio. The new modularization features enable them to avoid redundant efforts, reduce costs, and accelerate product development.  A wide range of product variants presents both opportunities and challenges for companies. On the one hand, it allows products to be individually configured by customers and adapted to regional markets. On the other hand, the product portfolio can quickly become complex, driving up costs and slowing down development. With Variants, CONTACT Software provides a powerful module for variant management within its Elements platform, helping companies better organize product variety and efficiently manage a broad range of variants. CONTACT has now added modularization functions to its variant management. These enable companies to further standardize their product portfolio, reduce complexity at the product level, and avoid duplicates. As a result, they can develop new variants more efficiently and

Siemens Digital Industries Software announced it has extended its longstanding collaboration with TSMC through multiple new development projects, product certifications and innovative technology enablement for the foundry’s newest process technologies. Mutual customers can develop highly differentiated end-products with confidence using Siemens’ best-in-class EDA solutions together with TSMC’s industry-leading silicon process and advanced packaging technologies. "Strengthening our ongoing alliance with Open Innovation Platform® (OIP) ecosystem partners like Siemens keeps us at the forefront in accelerating advancements in 3D IC design for AI innovation," said Dan Kochpatcharin, Head of Ecosystem and Alliance Management Division at TSMC. "Our longtime collaboration with Siemens allows our mutual customers to fully harness the power, performance, and efficiency of TSMC's cutting-edge technologies." N2/N3 Certifications Siemens’ Calibre® nmPlatform tool is now certified for TSMC’s N2 and N2P processes. The N2 certification includes the new LSVRF (Local Standard Verification Rule Format) functionality in Calibre, which enables independent rule checking within specific regions of a

Siemens Digital Industries Software announced the latest updates to its Simcenter™ Testlab™ offering to help advanced manufacturers on their journey to zero prototypes and develop products faster, smarter and earlier. The journey to zero prototypes really means zero full product prototypes, with physical testing still playing a critical role in testing the components that make up the full system. Tests of these components are then used to correlate and update the corresponding simulation models to ensure they accurately predict the real world. This ultimately helps development teams test different variations and configurations faster than they could before and is enabled by new capabilities in Simcenter Testlab to enhance testing efficiency, expand testing capabilities, improve collaboration and automation. “Manufacturers are looking for opportunities to accelerate their zero prototypes initiatives. Advances made with Simcenter Testlab demonstrate how the use of virtual pre-test planning with the reuse of digital twin data, when combined with centralized

Synopsys, Inc. announced its continued, close collaboration with TSMC to deliver advanced EDA and IP solutions on TSMC's most advanced process and 3DFabric technologies to accelerate innovation for AI and multi-die designs. The relentless computational demands in AI applications require semiconductor technologies to keep pace. From an industry leading AI-driven EDA suite, powered by Synopsys.ai™ for enhanced productivity and silicon results to complete solutions that facilitate the migration to 2.5/3D multi-die architectures, Synopsys and TSMC have worked closely for decades to pave the path for the future of billion to trillion-transistor AI chip designs. "TSMC is excited to collaborate with Synopsys to develop pioneering EDA and IP solutions tailored for the rigorous compute demands of AI designs on TSMC advanced process and 3DFabric technologies," said Dan Kochpatcharin, head of the Ecosystem and Alliance Management Division at TSMC. "The results of our latest collaboration across Synopsys' AI-driven EDA suite and silicon-proven IP have helped our

Cadence Design Systems, Inc. announced that it is collaborating with TSMC to enhance productivity and optimize product performance for AI-driven advanced-node designs and 3D-ICs. The rapid adoption of AI applications has created unprecedented demand for advanced silicon solutions capable of handling colossal datasets and computations. To meet these escalating requirements, the industry is pushing the boundaries of advanced-node silicon and 3D-IC technologies. TSMC and Cadence are at the forefront of this revolution, together empowering customers to accelerate time to market while increasing performance. TSMC has certified Cadence’s industry-leading digital and custom design flows for implementation and signoff on TSMC’s latest N3 and N2P process technologies. As long-standing design technology co-optimization (DTCO) partners, TSMC and Cadence continue that tradition by collaborating to optimize power, performance and area (PPA) on A16, adding EDA features to enable advanced features such as backside routing. Cadence and TSMC are also collaborating on Cadence.AI to drive next-generation digital and analog design automation fueled by

Ansys and TSMC have expanded their collaboration to leverage AI for advancing 3D-IC design and develop next generation multiphysics solutions for a wider array of advanced semiconductor technologies. Together, the companies developed new workflows to analyze 3D-IC, photonic, electromagnetic (EM), and radio frequency (RF) designs while achieving higher productivity. These capabilities are critical to creating the world’s leading semiconductor products for high-performance computing (HPC), AI, datacenter connectivity, and wireless telecommunication. Productivity enhancement with AI Creating the right 3D-IC design that optimizes thermal and electrical effects — such as channel profile — requires extensive, time-consuming design flows. To minimize this constraint, designers use Ansys optiSLang® process integration and optimization software to quickly identify optimal design configurations through automation. By integrating optiSLang and Ansys RaptorX™ silicon-optimized EM solver for design analysis and modeling into the design process earlier, the solution reduced the number of EM simulations and demonstrated co-optimized channel design. This time savings delivers lower design costs and

Altair, a global leader in computational intelligence, has announced its involvement in the £5.8 million Performance Integrated Vehicle Optimization Technology (PIVOT) project, supported by Innovate UK and the Advanced Propulsion Centre (APC). The project aims to revolutionize vehicle manufacturing by creating lighter, more sustainable components, thanks to Altair’s cutting-edge artificial intelligence (AI) and simulation capabilities. Led by Sarginsons Industries, the PIVOT project brings together key partners including Altair, Aston Martin, Brunel University London, and metal recycling experts GESCRAP. The initiative will develop innovative software that combines casting simulation, topology optimization, and AI, which will enable organizations to design components optimized for weight, structural performance, and manufacturability. These breakthroughs will result in cast aluminum structures that are up to 30% lighter while maintaining performance requirements. “This collaboration demonstrates how our AI-powered engineering technology enables manufacturers to develop more efficient vehicle components, cutting down on weight and drastically reducing environmental impact,” said Sam Mahalingam, chief technical officer, Altair. “We are proud to work with like-minded

Atos announces that it has been selected by the European Space Agency (ESA) to lead a consortium tasked with an initial 12-month mission to expand the capabilities of the Destination Earth (DestinE) services platform. To accomplish this task, the Group will design and implement advanced applications and services (AAS). Kick-started by the European Commission, DestinE has the following components: digital twins of the Earth; a data lake to process big data in the cloud; and a services platform engineered by ESA. AAS will expedite the use of DestinE platform data as well as the roll-out of services by stakeholders within Europe’s ecosystem. As a result, European Union member states, European institutions, manufacturers, academics and scientists will be able to devise strategies for adapting to climate change and implement accurate, actionable measures that ensure mitigation. Together with its partners Mews and ACRI-ST, Atos will support ESA in its efforts to pinpoint and deploy pioneering technologies in generative AI, data fusion and 3D visualization. These technologies will be

Siemens Digital Industries Software announced that Japan-based Preferred Networks Inc. (PFN), a leader in deep learning and artificial intelligence technology, has selected Siemens’ PowerPro™ software to optimize the power efficiency of its next-generation AI processors. Founded in 2014, PFN is known for cutting-edge research and development in areas like machine learning, robotics and autonomous systems. The company collaborates with innovators across a range of industries, including manufacturing, healthcare and transportation, to integrate AI solutions into their operations. PFN used the software’s broad array of power-saving register transfer-level (RTL) features to develop a new generation of AI integrated circuits (ICs) that deliver exceptional performance and low power consumption. Siemens’ PowerPro software also enabled PFN to rapidly conduct accurate power estimation for both RTL and gate-level designs, allowing its design teams to quickly find and address power issues during RTL development – helping to dramatically enhance the power efficiency of its next generation AI semiconductor designs. “Siemens’