CIMdata Blog

Cadence announced it is furthering its longstanding collaboration with TSMC to accelerate time to silicon for 3D-IC and advanced-node technologies through certified design flows, silicon-proven IP and ongoing technology collaboration. As a leading provider of IP for TSMC N2P, N5 and N3 process nodes, Cadence continues to deliver cutting-edge AI-driven design solutions to the TSMC ecosystem for multiple horizontal applications from chiplets and SoCs to advanced packaging and 3D-ICs. The deep collaboration encompasses certified tools and flows for TSMC’s N2P and A16™ technologies, paves the way for TSMC’s A14 and further unlocks 3D-IC possibilities by extending support for TSMC 3DFabric® design and packaging. In addition, Cadence and TSMC are extending tool certification for newly announced TSMC N3C technology based on available N3P design solutions. N2P and A16 AI Silicon Design Cadence is driving innovation in AI chip design with certified tools and optimized IP for TSMC’s advanced N2P and A16™ process technologies. Reinforcing its memory

Siemens Digital Industries Software announced that the company has deepened longstanding collaboration with TSMC to drive innovation in semiconductor design and integration, enabling mutual customers to tackle the challenges of next-generation technologies. Building on a series of recent collaborations, Siemens has achieved certification for its Calibre® nmPlatform software suite—including nmDRC, nmLVS, Calibre® YieldEnhancer™, and PERC™ tools—alongside its Analog FastSPICE (AFS) and Solido™ solutions, for TSMC’s cutting-edge N2P and A16 processes. Additionally, its Calibre® 3DSTACK solution is certified for TSMC’s 3DFabric® technologies and the 3Dblox standard, advancing silicon stacking and packaging design. Siemens and TSMC are further advancing tool certifications for the newly announced TSMC N3C technology, building on the available N3P design solutions. The two companies have also initiated collaboration on design enablement for TSMC’s newest A14 technology, laying the groundwork for the next-generation designs. The Siemens and TSMC partnership significantly advances system and semiconductor design for AI, automotive, hyperscale, mobile and other key applications,

Synopsys, Inc. announced its ongoing close collaboration with TSMC to deliver robust EDA and IP solutions for TSMC's most advanced processes and advanced packaging technologies to accelerate AI chip design and 3D multi-die design innovation. Among the newest collaborations is availability of certified digital and analog flows on TSMC A16™ and N2P processes for design productivity and optimization, enabled by Synopsys.ai™, and initial development of EDA flows on TSMC's A14 process. Synopsys and TSMC are also working on the tool certification for the newly announced TSMC N3C technology, building on the available N3P design solutions. To further accelerate semiconductor design for ultra-high-density 3D stacking, the Synopsys 3DIC Compiler, certified by TSMC, supports 3Dblox and enables TSMC's CoWoS® technology with 5.5x-reticle interposer sizes. In addition, Synopsys provides complete, silicon-proven IP solutions on TSMC's advanced processes, enabling designers to rapidly integrate the necessary functionality into their next-generation designs with the lowest power and maximum performance. "Synopsys and TSMC

Outbuild, a construction scheduling and planning software company, announced a new integration with Autodesk Construction Cloud®, a portfolio of software and services that combines advanced technology, a builders network and predictive insights for construction teams. This integration allows construction professionals to directly integrate their schedule into Autodesk® Build, eliminating the need to rely on manual file imports. An up-to-date construction schedule is critical to project success, but historically, schedules have been managed in siloed, legacy software that the majority of key project stakeholders cannot access. Miscommunication related to the schedule can lead to delays and rework, therefore increasing project costs. A study by Autodesk and FMI revealed that 48% of all rework in U.S. construction projects stems from miscommunication and poor project data, resulting in an estimated $31.3 billion in rework costs annually. Outbuild’s new integration with Autodesk Construction Cloud directly addresses this issue, providing an integrated solution aimed to improve efficiency related to updating and sharing the project

IFS, the leading provider of enterprise cloud and Industrial AI software, has launched a new migration accelerator service, designed to help SAP customers move seamlessly and quickly from existing SAP systems to IFS Cloud and immediately start generating value from Industrial AI. With many SAP customers in the process of modernizing and rethinking their enterprise landscape, the IFS accelerator offers a proven, low-risk approach for businesses to migrate their technology estate, empowering them to break free from monolithic, legacy systems and take advantage of IFS.ai. This shift towards a multi-vendor, multiplatform, digital ecosystem drives transformation and business agility through a modern, composable tech stack. The accelerator service enables SAP customers to diversify their portfolio of products beyond a singular vendor and deploy IFS Cloud with minimal disruption. The accelerator is tailored to address the complexity and risk often associated with enterprise software migrations, providing a clear, structured path to accelerate cloud adoption

Through continued collaboration with TSMC, Ansys announced enhanced AI-assisted workflows for radio frequency (RF) design migration and photonic integrated circuits (PICs), and new certifications for its semiconductor solutions. Together, Ansys and TSMC facilitate optimized 3D integrated circuit (3D-IC) design and accelerate market readiness for AI and high-performance computing (HPC) chip applications. Ansys and TSMC are also extending tool certification for the newly announced N3C technology, based on available N3P design solutions. A16 EM/IR and thermal certification RedHawk-SC, RedHawk-SC Electrothermal, and Totem are certified for TSMC’s advanced silicon process A16™ with Super Power Rail, a best-in-class backside power delivery solution for analog/block-level and SoC-level electromigration (EM) and voltage drop (IR) analysis. To ensure reliable thermal management for the TSMC A16 process, Ansys and TSMC developed a more precise thermal analysis flow. The enhanced method leverages TSMC's thermal specifications, providing accurate temperature calculations, and enhancing performance in advanced applications. In addition, Ansys and TSMC continue collaborating

ALLPLAN, a leading provider of BIM solutions for the AEC industry, introduces a comprehensive service release with ALLPLAN 2025-1. The latest enhancements further streamline design-to-build workflows and strengthen cloud connectivity, enabling professionals across all disciplines to work faster and more precisely. "With ALLPLAN 2025-1, we are taking digital workflows to the next level. By combining enhanced structural design capabilities and deeper cloud integration, we empower our users to accelerate projects, improve precision, and boost overall efficiency," says Eduardo Lazzarotto, Chief Product and Strategy Officer at ALLPLAN. Key Enhancements in ALLPLAN 2025-1 Seamless structural data exchange with SAF integration The Structural Analysis Format (SAF) improves interoperability in BIM projects by facilitating direct imports into BIMPLUS and enabling SAF file tracking and management in Excel. This ensures greater transparency in the planning process and a seamless connection between structural analysis and digital design workflows. Optimized structural workflows with FRILO by ALLPLAN The FRILO BIM-Connector is now fully integrated into BIMPLUS, streamlining structural engineering workflows. Engineers can access

Capgemini announced an extended agreement with Team Penske to roll out its Sustainability Data Hub (SDH), further accelerating Penske’s position as a sustainability trailblazer in motorsports. Capgemini’s cutting edge platform will help enable Penske to streamline efficiencies in environmental reporting and unlock deeper insights to help reduce its carbon footprint. With Capgemini’s SDH, Team Penske will bring greater automation and transparency to its sustainability reporting across operations. The platform enables on-demand data collection, reporting, and robust compliance monitoring, giving Team Penske the tools to make informed, data-driven decisions as it advances its sustainability strategy. The valuable insight will help directly drive efficiencies across the wider organization. The announcement builds on Team Penske’s milestone achievement of becoming the first major motorsports team to fuel all tractors and support equipment for headline races with renewable diesel – setting a new standard for the racing industry. This continued collaboration between Penske and Capgemini reflects a growing demand across high-performance

Robi Decking, a leading manufacturer of premium hardwood decking and architectural wood products, has announced a partnership with BIMsmith, the leading product research platform for building professionals, for the development of new Building Information Modeling (BIM) tools for architects, designers, and other building professionals. The partnership includes a set of new Building Information Modeling (BIM) product models for Robi Decking’s line of sustainably harvested hardwood decking, rainscreen siding, porch flooring, and architectural wood products. These digital models contain key data representing geometric and aesthetic properties, supporting more accurate early-stage design. Each model is natively built for Autodesk Revit, the global leader in BIM design software. The collaboration also makes Robi Decking’s products available on BIMsmith Market, the leading cloud platform used by architects and engineers to conduct building product research and download Revit content. “Architects are constantly seeking materials that bring durability, sustainability, and natural beauty into their projects,” said Elizabeth Earley, Marketing

Together with Koenig & Bauer, a global printing press manufacturer, technology company Siemens will accelerate development and commissioning processes for printing presses with a new machine automation platform. The standardized and modular automation platform enables machine building customers to create predictive maintenance models and performance dashboards for individual machine components. The companies are working together to help machine builders find their optimal machine configuration using a digital twin with Siemens’ Teamcenter® software for Product Lifecycle Management (PLM) and Siemens NX™ software for product design and engineering. This helps them to create and maintain an accurate and synchronized virtual representation of their machine. Simatic AX software capabilities are also available to customers for programming and maintaining Siemens PLCs (programmable logic controllers) – which reduces time-to-market, increases product quality, and enhances the maintainability of the control software. The offerings will be available on the Siemens Xcelerator Marketplace. “The partnership with Koenig & Bauer is