CIMdata Blog

Simulations Plus, Inc. (“Simulations Plus”), a leading provider of biosimulation, simulation-enabled performance and intelligence solutions, and medical communications to the biopharma industry, announced that it has been awarded a newly funded grant from the U.S. Food and Drug Administration (FDA) to use physiologically based pharmacokinetic (PBPK) approaches in GastroPlus® to build and validate mechanistic in vitro-in vivo correlations (IVIVCs) for long-acting injectable (LAI) technologies through a joint proposal with the University of Connecticut’s School of Pharmacy, Department of Pharmaceutical Sciences. This project aims to use the GastroPlus PBPK platform to investigate the intricate relationship between LAI formulation critical quality attributes (CQAs) and physiological factors at the injection site to accurately predict in vivo drug release and absorption. Dr. Diane Burgess, Board of Trustees Distinguished Professor of Pharmaceutics and Pfizer Distinguished Endowed Chair of Pharmaceutical Technology at the University of Connecticut and her lab will generate in vitro and in vivo data for marketed LAI suspension products using novel discriminatory systems. The

PROS Holdings, Inc., a leading provider of AI-powered SaaS pricing, CPQ, revenue management and digital offer marketing solutions, announced that TAP Air Portugal will expand its use of PROS market-leading revenue management and pricing tools to create optimized offers and fuel its path to modern airline retailing. By adopting PROS latest innovation in revenue management capabilities, as well as expanding its use of PROS Real-Time Dynamic Pricing and Group Sales Optimizer, TAP will create more optimal offers that increase booking conversions, improve customer satisfaction and react more quickly to changing market dynamics. PROS Revenue Management with Willingness-to-Pay (WTP) enables TAP to leverage PROS most advanced AI-powered solution to forecast the relationship between price and demand, optimizing class availability based on price sensitivity. This helps TAP tailor offers by customer segment without alienating budget-conscious travelers. Understanding WTP also allows TAP to price strategically in their markets, maximizing revenue while remaining attractive to specific customer segments. Mario

Vertiv is collaborating with Ansys to digitally transform its design of data center cooling systems. Ansys digital engineering technology will help Vertiv improve scalability, enable early decision-making, and empower sales teams to swiftly provide customer quotes, reducing their go-to-market timelines. Heat exchanger (HX) coils are key to the operation of data center thermal management systems; they efficiently transfer heat away from hardware and are highly customizable. However, HX coils are challenging and time-consuming to design given the complexity of the multiphysics and design expertise involved. With Ansys technology, Vertiv's engineering team can reduce development time and create predictively accurate, reliable designs. Specifically, Minerva enables experts and non-experts to build and publish web applications to search for designs or generate new ones that meet customer requirements. This accessibility eliminates the designer-to-engineer handoff that causes time delays. With the AI-enhanced optimization framework of optiSLang, Vertiv can reduce material usage and lower costs by rapidly simulating ideal

Roadzen Inc. ("Roadzen" or the "Company”), a global leader in AI at the convergence of insurance and mobility, announced its second quarter and six-month financial results for the period ended September 30, 2024. Rohan Malhotra, Founder and CEO of Roadzen, stated, "This quarter marked substantial progress in revenue acceleration, product development, and cost reduction. With 33% sequential revenue growth and a 25% improvement in Adjusted EBITDA loss from the prior quarter, we are advancing our long-term strategy. We expect revenue momentum to continue in the second half of FY25 as we aim to resume U.K. sales and pursue growth in the U.S. and India." Malhotra continued, “The verticalization of AI for legacy industries like insurance presents a generational opportunity, and our pioneering work at the convergence of AI, insurance and mobility delivers a better auto insurance experience to clients across the world. Our technology enables precise risk assessments, personalized pricing, real-time claims

In fiscal 2024 (ended September 30, 2024), Siemens successfully continued its profitable growth trajectory, made important strategic progress and achieved record highs as a leading technology company.  “In another successful fiscal year, we delivered record profit and stringently executed our strategy. In particular, we benefited from continuing strong demand for electrification, transportation and our industrial software offerings while our automation business remained challenging,” said Roland Busch, President and CEO of Siemens AG. “Starting in fiscal 2025, we will take Siemens to the next level of value creation. We will continue to invest in R&D and M&A to secure faster growth based on our technological strengths and ability to scale across industries. Our planned acquisition of Altair reinforces our leadership in industrial software and AI. Our ability to combine the real and digital worlds is unmatched.” “At €9.5 billion, we again achieved excellent free cash flow in fiscal 2024,” said Ralf P. Thomas, Chief Financial Officer of

ALLPLAN, a global provider of AEC software, has successfully delivered version 2025 of its structural analysis software FRILO, bringing a variety of new, powerful features and program updates to the market. The highlights of FRILO 2025 include a direct interface to the BIM software ALLPLAN for more efficient reinforcement of reinforced concrete columns, the new PLUS program SLS+ for the design of splice connections, and the option of designing one- and two-sided transverse joints to timber beams with the HO12+. Design of Splice Connections with SLS+ New reinforcement workflow with B5+ and ALLPLAN Dimensioning of transverse joints to timber beams with HO12+ Simulation of partial core failure of the timber beams with HTV+ New design options for mast foundations with FDM+ With the new version FRILO 2025, ALLPLAN launched a new PLUS program for designing single-axis stressed bolted girder joints with splices for steel constructions. SLS+ allows structural engineers to define splice connections that are characterized

With the susietec® toolset, Kontron, a leading global provider of IoT/Embedded Computing Technology (ECT), offers a combination of software, hardware and expertise, that enables companies to implement holistic digital transformation solutions. Thanks to the expansion of the hardened Linux®-based KontronOS operating system, Kontron susietec® IoT Bundles offer more flexibility for cross-industry IoT applications. With the susietec® IoT Bundles, Kontron supports international digital transformation projects with specially matched solutions consisting of software and hardware products. The latest update of KontronOS offers the option of securely installing and updating native applications in addition to Docker containers, while the subsystem remains in read-only mode. This ensures a significantly higher level of security, because the system core remains impenetrable. The KontronOS update function includes both the operating system and customer applications. This provides a flexible and secure environment for the widest range of applications. The integration of this new functionality makes KontronOS an even stronger platform for the secure

Lantek v44 Strengthens Connectivity Between Workshop and MES Systems to Enhance Real-Time Operational Control, Data Flow, and Decision-Making Lantek, a global pioneer in the digital transformation of sheet metal cutting and processing, will showcase its latest developments at the upcoming MetalMadrid event, taking place on November 20-21 at IFEMA, Madrid. The company will welcome over 14,000 expected visitors from its stand 9E31, located in Hall 9 of the Madrid exhibition center.  Lantek v44: Connect. Live. Smart. MetalMadrid will serve as the launch venue in Spain for Lantek’s latest software suite, Lantek v44. This release marks a major step forward in smart factory technology, redefining productivity with its "Connect. Live. Smart" approach. The new version enhances connectivity, data flow, and real-time decision-making, leveraging cutting-edge tools. Lantek’s software suite provides unparalleled visibility, radically transforming how sheet metal manufacturers operate.  Machine Connectivity Technology Machine connectivity is a key advancement for the metal industry, enabling the direct transmission of machine

MathWorks, the leading developer of mathematical computing software, and NXP® Semiconductors, the worldwide leader in automotive processing, announced the availability of the Model-Based Design Toolbox (MBDT) for Battery Management Systems (BMS). The toolbox enables engineers to model, develop, and validate BMS applications in MATLAB® and Simulink®, automate C code generation from MATLAB for NXP Battery Cell controllers, and also support NXP’s software solution, the BMS SDK components. BMS is crucial for EVs as it ensures the optimal performance, durability, and safety of the battery packs that power these advanced vehicles. The BMS design process increasingly relies on modeling and simulation to fine-tune algorithms tailored to EVs' specific battery cell types and battery pack configuration. Model-Based Design enables the efficient design of the BMS algorithms, providing a means to test them in simulation for different scenarios, such as driving habits, environmental conditions, and fault occurrences. MBDT for BMS makes it easy for engineers to transition directly from Simulink models to

Siemens Digital Industries Software announced today the latest advancement in its electronic systems design portfolio. The next generation release takes an integrated and multidisciplinary approach, bringing together Xpedition™ software, Hyperlynx™ software and PADS™ Professional software into a unified user experience that delivers cloud connectivity and AI capabilities to push the boundaries of innovation in electronic systems design.  The challenges of engineering talent shortages, supply chain uncertainties and the increasing complexity of designs in the electronic systems design industry have impacted engineers and the development ecosystem, hindering their ability to meet the demands of modern electronics development.  Siemens' next-generation electronic systems design solution aims to address these challenges head-on by delivering an intuitive, AI-enhanced, cloud-connected, integrated and secure solution to empower engineers and organizations in this dynamic environment.  "We are thrilled to announce the release of our next-generation electronic systems design solution, tailored to meet the critical needs of today's electronics engineers and the