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Siemens Digital Industries Software announced Innovator3D IC™, new software that delivers a fast, predictable path for the planning and heterogeneous integration of ASICs and chiplets using the latest and most advanced semiconductor packaging 2.5D & 3D technologies and substrates in the world. Siemens’ Innovator3D IC provides a consolidated cockpit for constructing a digital twin -- featuring a unified data model for design planning, prototyping and predictive analysis -- of the complete semiconductor package assembly. This cockpit drives implementation, multi-physics analysis, mechanical design, test, signoff, and release to manufacturing. By unifying power, signal, thermal, and mechanical stress analysis tools, it enables rapid ‘what-if’ exploration, while identifying, avoiding and solving challenges prior to detailed design implementation. This shift-left approach can prevent costly and time-consuming downstream rework or suboptimal results. “Siemens already had the most comprehensive portfolio of semiconductor packaging related technologies available as part of Siemens Xcelerator,” said AJ Incorvaia, senior vice president of Electronic

Aspen Technology, Inc., a global leader in industrial software, announced a three-year partnership agreement with Oregon State University (OSU) that expands traditional academic collaborations focused on incorporating process simulation solutions into curricula by adding sustainability software, training and competency development. The partnership aims to help students build industry-ready skills and knowledge to make an accelerated impact on critical sustainability initiatives upon entering the workforce.  “Generational workforce changes have made it more important than ever to quickly and effectively prepare new engineers with the skillsets required to successfully enter the workforce and help companies innovate and tackle the challenges associated with net-zero ambitions,” said Steven Qi, SVP, Customer Support & Training, AspenTech.  “Over the next three years, hundreds of our students and faculty will learn new digital competencies that we expect to have a direct impact on global sustainability efforts,” said Chih-hung (Alex) Chang, PhD, Stephen Slavens Faculty Scholar, Professor & Associate Head

Velo3D, Inc., a leading additive manufacturing technology company for mission-critical metal parts, announced that its Board of Directors has formally appointed Brad Kreger, who has been serving as the company’s Interim Chief Executive Officer since December 2023, as the company’s permanent Chief Executive Officer. The Board of Directors cited the success of Velo3D’s re-alignment initiatives under Mr. Kreger as well as his implementation of strategic initiatives that have resulted in business momentum over the last 6 months. “I am pleased to announce the Board has appointed Mr. Kreger as permanent Chief Executive Officer,” said Carl Bass, Chairman of the Board of Velo3D. “Under Mr. Kreger’s leadership, the company has executed on its re-alignment initiatives, materially reduced its cost structure and improved overall operating efficiency. At the same time, his customer-first go-to-market strategy has resulted in an acceleration of orders from both new and existing customer, reflecting confidence in the company’s technology

The Supervisory Board today approved the premature extension of Peter Schneck's contract. The Management Board contract, originally concluded for three years, has now been extended for a period of five years until 17 October 2029. Peter Schneck joined CENIT AG as a member of the Management Board on 18 October 2021 and was appointed CEO on 1 January 2022.  To view the original press release, please click here. Search for CENIT on CIMdata.com

Dassault Systèmes announced the appointment of Sabine Scheunert as Managing Director, EUROCENTRAL. In this role, Scheunert will drive the implementation of Dassault Systèmes’ corporate strategy across Austria, the Czech Republic, Germany, Hungary, Poland, Slovakia, Slovenia and Switzerland, focusing on strengthening business relationships and expanding the company’s footprint in the manufacturing, life sciences and healthcare, and infrastructure and cities sectors. She succeeds Dominic Kurtaz, who will take on new global opportunities within the company. “Sabine brings a unique blend of business acumen, strategic vision, and leadership skills essential for driving our EUROCENTRAL business, developing our workforce, and growing our partner ecosystem,” said Olivier Ribet, Executive Vice President, EMEA, Dassault Systèmes. “I would also like to thank Dominic for his transformative leadership over the past four years. His experience will be invaluable in his new global role.” Scheunert is a recognized leader with extensive international experience. Before joining Dassault Systèmes, she served as Vice

HCLTech, a leading global technology company, announced the opening of new offices in East Brunswick, New Jersey and Santa Clara, California, further strengthening its footprint in North America. The company celebrated the office launch in New Jersey with a traditional Indian ceremony, a community service activity with employees and a grand opening party with clients and partners. The Santa Clara office will officially open in mid-August. Situated at prime business hubs on the NJ Turnpike and California Highway 237 respectively, the facilities are outfitted with state-of-the-art technology spaces to foster collaboration, creativity and culture for its people, while bringing services and innovation closer to clients and ecosystem partners.  According to Chief Marketing Officer Jill Kouri, “The offices will offer all of the post-COVID features of modern workspaces that will encourage our people to want to work from the office. Both locations will feature HCLTech’s Customer Experience Center (CEC) showcasing the best of company’s innovations

Hexagon’s Asset Lifecycle Intelligence division announced the recipients of the fourth annual Hexagon Elite Awards presented to customers who are champions of progress and innovation using the company’s solutions. This year’s Elite Award winners are being recognized at 10 regional Hexagon LIVE 2024 “Make Data Make Sense Series” conferences, starting with the kickoff event in Grapevine, Texas, this week. These events are designed for customers and prospects to exchange ideas about projects and future strategies. Each event also provides an opportunity to see innovative Hexagon solutions live and connect with the Hexagon team. Other “Make Data Make Sense Series” events are planned this year in Spain, India, Australia, Indonesia, Japan, South Korea, Thailand, the Philippines and Italy. The Hexagon Elite Awards annually recognize Asset Lifecycle Intelligence division customers aligned with the Smart Digital Reality™, a unified, role-based, real-time view of the physical and digital realities across a project and asset portfolio. It is powered by the

Logility, Inc., a leader in AI-first supply chain planning software, announced its collaboration with Worldly, a sustainability insights and data platform, to support compliant digital supply chains. Logility leverages Worldly’s comprehensive source of Environmental, Social, and Governance (ESG) data used by over 40,000 brands, retailers, and manufacturers to inform its innovative vendor management, traceability, and corporate responsibility applications. Driven by consumer demand, regulation, and corporate ESG initiatives, organizations increasingly require transparency across their global supply chains. "Organizations need primary data and deep visibility into their supply chains to understand their true social and environmental impacts and keep up with emerging regulations," said James Schaffer, Worldly Chief Strategy Officer. "In partnering with Logility, Worldly can provide global brands, retailers, and manufacturers a comprehensive view of their sustainability performance while helping them prepare for new legislation." Joint clients of Logility and Worldly are managing over 3,500 tier one suppliers and over 10,000 tier two, tier

Schneider Electric, the leader in the digital transformation of energy management and automation, announced its endorsement and contribution to the U.S. Department of Energy’s Supply Chain Cybersecurity Principles. Developed to foster a more cyber-secure supply chain for critical infrastructure worldwide, this guidance was the result of a joint effort led by the Department of Energy (DOE) Office of Cybersecurity, Energy Security, and Emergency Response (CESER) in collaboration with industry manufactures such as Schneider Electric, its peers, and end users to address supply chain cybersecurity risk. Schneider Electric has been a leader in the industry collaborating closely with partners on supply chain cybersecurity globally. Schneider has maintained a close partnership with DOE who is working to protect the security and reliability of the energy sector. In 2020, Schneider Electric volunteered to partner with the DOE Office of Cybersecurity, Energy Security, and Emergency Response (CESER) for their Cyber Testing for Resilient Industrial Control System program (CyTRICS). These latest principles are another

In a leap towards revolutionizing quantum computing and enhancing the energy efficiency of data centers, Semiwise, sureCore, and Cadence have collaborated to overcome critical challenges in developing cryogenic CMOS circuits. The collaborative effort has culminated in the successful modification of transistor models on GlobalFoundries 22FDX® in the Cadence® Spectre® Simulation Platform, thereby enabling the process of analog, mixed-signal, and digital circuit simulation and verification at cryogenic temperatures. The milestone reached in this collaboration springs from the Semiwise Innovate UK project “Development of CryoCMOS to Enable the Next Generation of Scalable Quantum Computers,” during which Semiwise crafted the first robust transistor SPICE models designed to function in extreme cryogenic environments. This advancement is pivotal for quantum computing, drastically increasing the potential number of qubits within a system and significantly expanding the computational capabilities necessary for tackling complex, real-life problems. "We were able to develop production-worthy designs for cryogenic CMOS circuits by using cryogenic transistor measurements performed