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nTop, the leader in computational design software for high-performance engineering, announced the launch of nTop 5, the next generation of its flagship product, which includes major integrations from five new partners to its developer ecosystem. Materialise, Autodesk, Hexagon, Intact Solutions, and cloudfluid have all built nTop interoperability into their software to provide users with a better end-to-end process for high-performance designs across simulation and manufacturing applications. This latest update also features a powerful new kernel that enables designs with greater precision and accelerates common design operations, saving engineering time. “For over 10 years, our mission at nTop has been to help high-performance engineering teams design beyond the limits of traditional software,” said Bradley Rothenberg, co-founder and CEO, nTop. “Our customers have amazed us with the products they’ve developed in nTop – from super-efficient heat exchangers, to ultra-lightweight components for spaceflight and aeronautics, to patient-matched implants that enhance bone fusion, and more

Siemens Digital Industries Software announced a fully automated solution to help integrated circuit (IC) design teams rapidly identify and address Electrostatic Discharge (ESD) issues driven by the growing complexity of today’s next-generation IC designs, regardless of targeted process technology. Combining the power of Siemens’ Calibre® PERC™ software with the proven SPICE accuracy of its AI-powered Solido™ Simulation Suite, it provides a fast and highly accurate method for checking compliance against foundry rules spanning all phases of IC design. Supporting full-chip level verification, the solution helps engineering teams better manage design and manufacturing challenges in both established and emerging process nodes. Its context-aware checks can help to improve the accuracy of results, while reducing turnaround time for physical, circuit, electrical and reliability IC design verification. The solution’s context-aware checking allows design teams to verify ESD paths quickly, in time to secure waivers from foundry rules that can lead to smaller die sizes and

Siemens Digital Industries Software introduced Calibre® 3DThermal, innovative software for thermal analysis, verification and debugging in 3D integrated circuits (3D-ICs). Calibre 3DThermal enables chip designers to rapidly model, visualize and mitigate thermal effects in their designs from early-stage chip and package-inward exploration through to design signoff by incorporating elements of Siemens’ Calibre verification software and Calibre® 3DSTACK software along with the company’s Simcenter™ Flotherm™ software solver engine. Calibre 3DThermal provides the outputs necessary for thermal impacts to be considered in electrical simulations. Moreover, Calibre 3DThermal can both consume as input boundary conditions as well as provide output to Simcenter Flotherm – enabling true IC to system thermal modeling from IC to package to board to system level. Calibre 3DThermal was developed to address challenges of 3D-IC architectures where controlling heat dissipation is a key requirement. It offers fast, accurate, powerful and comprehensive approaches to identifying and rapidly addressing complex thermal issues.

Siemens Digital Industries Software introduced Solido™ Simulation Suite software(“Solido Sim” software), an integrated suite of AI-accelerated SPICE, Fast SPICE and mixed-signal simulators designed to help customers dramatically accelerate critical design and verification tasks for their next-generation analog, mixed-signal and custom IC designs. Built on the foundation of Siemens’ industry-proven, foundry-certified Analog FastSPICE (AFS) platform, Solido Sim incorporates three innovative new simulators:Solido™ SPICE software, Solido™ FastSPICE software and Solido™ LibSPICE software, as well as Siemens’ market-proven AFS platform, ELDO™ software and Symphony™ software. "Solido Simulation Suite, featuring AI-accelerated SPICE and FastSPICE engines, represents a significant leap forward in custom IC simulation technology, providing unmatched accuracy and efficiency for chip design and verification engineers,” said Michael Ellow, CEO, Silicon Systems, Siemens Digital Industries Software. "Our initial Solido Sim customers have experienced remarkable success across multiple processes technology platforms, all while demonstrating faster runtimes and enabling compelling new capabilities for their next-generation analog, RF, mixed-signal

Siemens Digital Industries Software announced Innovator3D IC™, new software that delivers a fast, predictable path for the planning and heterogeneous integration of ASICs and chiplets using the latest and most advanced semiconductor packaging 2.5D & 3D technologies and substrates in the world. Siemens’ Innovator3D IC provides a consolidated cockpit for constructing a digital twin -- featuring a unified data model for design planning, prototyping and predictive analysis -- of the complete semiconductor package assembly. This cockpit drives implementation, multi-physics analysis, mechanical design, test, signoff, and release to manufacturing. By unifying power, signal, thermal, and mechanical stress analysis tools, it enables rapid ‘what-if’ exploration, while identifying, avoiding and solving challenges prior to detailed design implementation. This shift-left approach can prevent costly and time-consuming downstream rework or suboptimal results. “Siemens already had the most comprehensive portfolio of semiconductor packaging related technologies available as part of Siemens Xcelerator,” said AJ Incorvaia, senior vice president of Electronic

Aspen Technology, Inc., a global leader in industrial software, announced a three-year partnership agreement with Oregon State University (OSU) that expands traditional academic collaborations focused on incorporating process simulation solutions into curricula by adding sustainability software, training and competency development. The partnership aims to help students build industry-ready skills and knowledge to make an accelerated impact on critical sustainability initiatives upon entering the workforce.  “Generational workforce changes have made it more important than ever to quickly and effectively prepare new engineers with the skillsets required to successfully enter the workforce and help companies innovate and tackle the challenges associated with net-zero ambitions,” said Steven Qi, SVP, Customer Support & Training, AspenTech.  “Over the next three years, hundreds of our students and faculty will learn new digital competencies that we expect to have a direct impact on global sustainability efforts,” said Chih-hung (Alex) Chang, PhD, Stephen Slavens Faculty Scholar, Professor & Associate Head

Velo3D, Inc., a leading additive manufacturing technology company for mission-critical metal parts, announced that its Board of Directors has formally appointed Brad Kreger, who has been serving as the company’s Interim Chief Executive Officer since December 2023, as the company’s permanent Chief Executive Officer. The Board of Directors cited the success of Velo3D’s re-alignment initiatives under Mr. Kreger as well as his implementation of strategic initiatives that have resulted in business momentum over the last 6 months. “I am pleased to announce the Board has appointed Mr. Kreger as permanent Chief Executive Officer,” said Carl Bass, Chairman of the Board of Velo3D. “Under Mr. Kreger’s leadership, the company has executed on its re-alignment initiatives, materially reduced its cost structure and improved overall operating efficiency. At the same time, his customer-first go-to-market strategy has resulted in an acceleration of orders from both new and existing customer, reflecting confidence in the company’s technology

The Supervisory Board today approved the premature extension of Peter Schneck's contract. The Management Board contract, originally concluded for three years, has now been extended for a period of five years until 17 October 2029. Peter Schneck joined CENIT AG as a member of the Management Board on 18 October 2021 and was appointed CEO on 1 January 2022.  To view the original press release, please click here. Search for CENIT on CIMdata.com

Dassault Systèmes announced the appointment of Sabine Scheunert as Managing Director, EUROCENTRAL. In this role, Scheunert will drive the implementation of Dassault Systèmes’ corporate strategy across Austria, the Czech Republic, Germany, Hungary, Poland, Slovakia, Slovenia and Switzerland, focusing on strengthening business relationships and expanding the company’s footprint in the manufacturing, life sciences and healthcare, and infrastructure and cities sectors. She succeeds Dominic Kurtaz, who will take on new global opportunities within the company. “Sabine brings a unique blend of business acumen, strategic vision, and leadership skills essential for driving our EUROCENTRAL business, developing our workforce, and growing our partner ecosystem,” said Olivier Ribet, Executive Vice President, EMEA, Dassault Systèmes. “I would also like to thank Dominic for his transformative leadership over the past four years. His experience will be invaluable in his new global role.” Scheunert is a recognized leader with extensive international experience. Before joining Dassault Systèmes, she served as Vice

HCLTech, a leading global technology company, announced the opening of new offices in East Brunswick, New Jersey and Santa Clara, California, further strengthening its footprint in North America. The company celebrated the office launch in New Jersey with a traditional Indian ceremony, a community service activity with employees and a grand opening party with clients and partners. The Santa Clara office will officially open in mid-August. Situated at prime business hubs on the NJ Turnpike and California Highway 237 respectively, the facilities are outfitted with state-of-the-art technology spaces to foster collaboration, creativity and culture for its people, while bringing services and innovation closer to clients and ecosystem partners.  According to Chief Marketing Officer Jill Kouri, “The offices will offer all of the post-COVID features of modern workspaces that will encourage our people to want to work from the office. Both locations will feature HCLTech’s Customer Experience Center (CEC) showcasing the best of company’s innovations