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 PDF Key takeaways: Products are becoming smarter and more connected and can often provide near- or real-time information about each product for analysis and better decision making The IoT and smart, connected products are providing companies new opportunities to add value to the their customers, expand and add new products, and to create new business models PTC continues to create and expand an ecosystem for defining and managing IoT solutions that can help their customers develop new products and business models CIMdata recently attended the PTC LiveWorx event held at the Hynes Convention Center and the Westin Copley hotel May 4 – 7, 2015, in Boston, MA, USA. This event gave PTC’s customers the opportunity to not only hear about and explore PTC’s solution strategies for the Internet of Things (IoT), but also to showcase their own work, network with peers, share ideas, and discuss how they are addressing their challenges on their IoT journey.

Siemens today announced the release of Omneo™ Performance Analytics (PA) solution, the latest application for its software as a service (SaaS) Omneo offering, which it obtained last year as part of its acquisition of Camstar. Omneo PA, developed by Siemens’ product lifecycle management (PLM) software business, delivers product performance intelligence from big data analytics. The solution monitors data across the entire supply chain and customer experience, while analyzing billions of data combinations in seconds. By revealing the hidden intelligence that pinpoints the source of product issues, Omneo PA delivers proactive analysis for big data.   “Performance Analytics empowers us to discover hidden patterns in data in order to ensure optimal product performance,” said Michael Shepherd, Senior Strategist of Product Management at Dell. “Through their big data analytics expertise Omneo is helping us quickly and more insightfully serve our customers.” “Omneo Performance Analytics harnesses the full potential of this powerful technology -- changing the

Sefaira, the market-leading daylighting visualization tool, has just announced a new feature for their software plugins for Autodesk Revit and Trimble Sketchup. In addition to the real-time visualizations announced last year, the new update adds customizable, exportable graphics which offer both a point in time analysis or an annual overview, and analysis tools which help designers easily identify overlit and underlit spaces and review heating or cooling requirements. The new additions come as part of a push to make Sefaira more useful in presenting to clients. “Sefaira’s mission is to empower every designer to create inspiring, high-performing buildings,” explains Sefaira CEO Mads Jensen. “To achieve this, designers need to be able to make good design decisions and also explain and defend them. Our new daylighting features address these demands, and further accelerate our work towards helping designers make great design decisions and to communicate these decisions to their clients.” The additions to the software have come from close collaboration with

 The OPENCut CNC hardware/software solution for plasma and oxy-fuel is designed to optimize startup, productivity, and cutting quality. The system comes with elements needed for plasma 2D, bevel, and oxy-fuel cutting. System modules from OPENCut are designed for the Open control OSAI CNC, up to the multi-touch operator panel, drives, and I/O systems controlled via EtherCAT fieldbus. The plasma generator system is available in 120A, 250A, and 420A sizes equipped with automatic gas console. The OPENCut, HMI and CAM software with 2D and 3D graphics for profile definition, has pre-defined icon libraries and automatic nesting of different profiles. Included in the system package are: graphic, multi-touch SW oriented HMI with 2D and 3D graphics for program execution control, easy-to-customize machine logic designed for plasma/oxy fuel, offset management compensation of bevel cutting parameters, 3D cutting head control, newest version CNC OPENcontrol, drives connected via EtherCAT or proprietary fieldbuses, and multi-tool drilling/milling heads management. “OPENCut is simple,

Geometric announced the availability of a new version 4.0 of its automated design for manufacturability solution, DFMPro for NXâ„¢ software. DFMPro version 4.0 delivers enhanced design flexibility with newly added support for additive manufacturing, tubing and sand casting processes. NX, developed by Siemens’ product lifecycle management (PLM) software business, is an integrated 3D computer-aided design, manufacturing and engineering analysis (CAD/CAM/CAE) software. Companies are changing the way they think, design and manufacture. A next generation technique such as additive manufacturing is gaining widespread adoption in major industries as it offers endless opportunities and opens doors for complex geometries and light-weight parts. However traditional manufacturing techniques such as sand casting are still going strong. With a variety of processes being used for manufacturing parts in a single product, DFMPro can help design engineers learn and apply manufacturing best practices for different processes thus avoiding downstream rework and cost problems. Design problems that result in secondary

Mentor Graphics Corp today announced that Mellanox Technologies has standardized on the new Mentor® Tessent® Hierarchical ATPG solution to manage the complexity and slash the cost of generating test patterns for their leading-edge integrated circuit (IC) designs. Using Tessent Hierarchical ATPG, Mellanox has significantly reduced both the processing time and system memory needed to generate the huge number of manufacturing test patterns needed for high-quality IC test. "The time needed to generate test patterns has been growing rapidly with each new design cycle, thus increasing our test-related costs," said Evelyn Landman, VP of Backend Engineering at Mellanox Technologies. "Moving to Mentor's Tessent Hierarchical ATPG flow has allowed us to significantly reduce turnaround time on current designs. Because this solution is highly scalable, we expect to continue using it on our future designs." The Tessent Hierarchical ATPG flow uses a divide-and-conquer approach to break down the overall ATPG task into smaller, more manageable pieces. Compressed patterns

AVEVA today announced that it has entered a multiyear agreement with Aker Solutions for AVEVA Everything3D (AVEVA E3D?). The Norwegian oil service company has selected AVEVA E3D to be its strategic 3D tool on plant design, modification and maintenance projects. This agreement is a continuation of a long-standing successful working relationship that spans more than 20 years. 'The deployment of AVEVA E3D will enhance productivity, enabling Aker to execute larger, more complex projects with less risk using the best solutions available on the market. AVEVA is unmatched in the engineering design world,' said Richard Longdon, CEO, AVEVA. 'We are very proud to be continuing our long-standing working relationship with Aker Solutions. Together we have advanced the development of our technology over many years and will continue to contribute to our strategic vision of a Digital Asset'. Dave Wheeldon, CTO, AVEVA added, 'Using AVEVA software, Aker Solutions benefit from complementary applications that draw

Wipro plans to open a “technology innovation centre” in Silicon Valley by the end of December 2015. This move is part of Wipro’s plan to build on its automation and artificial intelligence capabilities. Earlier this year, Wipro publically announced its intention to reduce its company headcount by 30 per cent through the use of robotic automation. Wipro CTO K.R. Sanjiy commented on this development: “Why Mountain View? Bay Area represents that right area where we can bring together a lot of start-ups [to work with our] customers. We are working with lots of start-ups in the automation space.” The firm currently plans to have roughly 100-150 people working out of the facility. To view the original press release, please click here. Search for Wipro on CIMdata.com

Ingram Micro has inked a deal to distribute EMC in New Zealand. The company will distribute the full range of EMC products and services, and Gary Bigwood, Ingram Micro New Zealand managing director, says the distributor is ‘excited’ about the opportunities the deal presents. “Whether it’s cloud computing, big data, trusted infrastructure or storage, EMC has class leading products across all these sectors and more,” Bigwood says. “We are absolutely delighted with this appointment and have great plans to work with EMC to rapidly grow its presence in New Zealand.” Phil Patton, EMC New Zealand country manager, says it is ‘imperative’ the vendor has ‘a high performing and progressive New Zealand distribution partner to deliver EMC technology’ to customers. “That’s why we selected Ingram Micro. “Our organisations share similar values and aspirations and we are looking forward to working together.” The deal extends Ingram Micro’s EMC footprint in the region, with Ingram Micro already an EMC

3D Systems announced a new cooperative R&D agreement with Naval Sea Systems Command's (NAVSEA) Naval Surface Warfare Center Carderock Division (NSWCCD). In accordance with this agreement, 3DS and the US Navy will jointly develop and evaluate 3D printing technology and materials for military uses, including helping the Navy fulfill a number of strategic initiatives. The US Navy's partnership with 3DS underscores the disruptive potential of 3D printing to redefine the supply chain for naval ship components, and reinforces 3DS' ability to continue to modernize the U.S. defense industrial base. "The US Navy is at the forefront of a concerted military effort to integrate 3D printing into their operations," said Neal Orringer, 3DS' Vice President of Alliances and Partnerships. "Through their Print-the-Fleet initiative, the Navy is educating sailors on the latest in digital manufacturing and accelerating adoption of 3D printing. We're proud that our technology—our direct metal printing and our advanced polymer