CIMdata Blog

Xometry, Inc., the global AI-powered marketplace connecting enterprise buyers with suppliers of manufacturing services, announced management will participate in a fireside chat at the JMP Securities Technology Conference on Tuesday March 5, 2024 at 10:30 a.m. Pacific. A webcast and replay of the presentation will be accessible within the Investor Relations section of Xometry’s website. Xometry’s two-sided marketplace plays a vital role in the rapid digital transformation of the manufacturing industry. Xometry’s proprietary technology shortens development cycles, drives efficiencies within corporate environments and helps companies create resilient supply chains. Xometry’s product portfolio includes: its industry leading digital marketplace; popular Thomasnet® industrial sourcing platform, and cloud-based tools, including Xometry Teamspace, centralized project management software for large, mission-critical projects. To view the original press release, please click here. Search for Xometry on CIMdata.com

Stratasys Ltd. will release financial results for the fourth quarter and full year ended December 31, 2023 on Thursday, March 7, 2024. The Company plans to hold the conference call to discuss its fourth quarter and full year 2023 financial results on Thursday, March 7, 2024 at 8:30 a.m. (ET). The investor conference call will be available via live webcast on the Stratasys Web site at investors.stratasys.com; or directly at the following web address: https://event.choruscall.com/mediaframe/webcast.html?webcastid=cZzaGlQr To participate by telephone, the U.S. toll-free number is 877-407-0619 and the international dial-in is +1-412-902-1012. Investors are advised to dial into the call at least ten minutes prior to the call to register. The webcast will be available for 6 months at investors.stratasys.com, or by accessing the above-provided web address. To view the original press release, please click here. Search for Stratasys on CIMdata.com

Ansys and Intel Foundry collaborated to provide multiphysics signoff solutions for Intel’s innovative 2.5D chip assembly technology, which uses EMIB technology to connect the die flexibly and without the need for through-silicon vias (TSVs). Ansys’ accurate simulation engines deliver higher speeds, lower power consumption, and greater reliability in advanced silicon systems for artificial intelligence (AI), high-performance computing, autonomous driving, and graphic processing. Ansys RedHawk-SC Electrothermal™ is an electronic design automation (EDA) platform that enables multiphysics analysis of 2.5D and 3D-ICs with multiple dies. It can perform thermal analysis with anisotropic thermal conduction, which is essential for Intel’s new backside power distribution technology. Thermal gradients also lead to mechanical stresses and warpage that can impact product reliability over time. Power integrity verification is done through chip/package co-simulation, which gives the 3D system-level context needed for maximum accuracy.  “Intel’s enablement of Intel 18A and EMIB technology is a differentiated approach to multi-die assembly that has a

Cadence and Intel Foundry have collaborated to develop and certify an integrated advanced packaging flow utilizing Embedded Multi-die Interconnect Bridge (EMIB) technology to address the growing complexity in heterogeneously integrated multi-chip(let) architectures. The collaboration enables Intel customers to leverage advanced packaging to accelerate the high-performance computing (HPC), AI, and mobile computing design space. The advanced EMIB flow enables design teams to seamlessly transition from early-stage system-level planning, optimization and analysis to DRC-aware implementation and physical signoff without converting data between different formats. This revolutionary collaboration promises to significantly reduce design cycles for complex multi-chip(let) packages. The joint effort has resulted in an advanced packaging flow, including Cadence’s Allegro® X APD (for placement, signal/power/ground routing, in-design electrical analysis, DFM/DFA and final manufacturing output), Integrity™ 3D-IC Platform and Integrity System Planner (for system-level design aggregation, planning and optimization), Sigrity™ and Clarity™ solvers (for 3D EM extraction, two-parameter generation, early-stage and signoff signal integrity, DC/AC power analysis, and

Cadence’s digital and custom/analog flows are certified on the Intel 18A process technology. Cadence® design IP supports this node from Intel Foundry, and the corresponding process design kits (PDKs) are delivered to accelerate the development of a wide variety of low-power consumer, high-performance computing (HPC), AI and mobile computing designs. Customers can now begin using the production-ready Cadencedesign flows and design IP to achieve design goals and speed up time to market. “Intel Foundry is very excited to expand our partnership with Cadence to enable key markets for the leading-edge Intel 18A process technology,” said Rahul Goyal, Vice President and General Manager, Product and Design Ecosystem, Intel Foundry. “We will leverage Cadence's world-class portfolio of IP, AI design technologies, and advanced packaging solutions to enable high-volume, high-performance, and power-efficient SoCs in Intel Foundry’s most advanced process technology. Cadence is an indispensable partner supporting our IDM2.0 strategy and the Intel Foundry ecosystem.” “The Cadence

CloudNC - a manufacturing technology company backed by Autodesk and Lockheed Martin - today announces that its CAM Assist solution can now create programming strategies and toolpaths with AI for 3+2 axis CNC machines. Previously, CAM Assist - which is available as a plug-in for Autodesk's Fusion software - generated machining strategies with AI for manufacturers using 3-axis CNC machines, helping them to create programs for the machines far more quickly than previously possible. The new upgrade means CAM Assist can now provide strategies and toolpaths for 3+2 axis components as well, enabling many more manufacturers to benefit from CAM Assist’s efficiency gains. With 3+2 axis support in place, CloudNC estimates that CAM Assist now can help around two-thirds of the CNC machining market. Dr Andy Cheadle, Chief Technology Officer at CloudNC, said: “This upgrade is not only a huge step forward in making CAM Assist even more useful for manufacturers around the

HCLTech, a leading global technology company, is expanding their longstanding collaboration with Intel Foundry to co-develop customized silicon solutions for semiconductor manufacturers, system OEMs and cloud services providers to enhance foundry services. This collaboration combines HCLTech's design expertise with Intel Foundry’s advanced technology and manufacturing capabilities to establish a resilient and diversified supply chain, heralding a new era of innovation and excellence. This collaboration aims to meet increasing global demand for semiconductor manufacturing, catering to the diverse silicon needs of clients, by providing them with a robust and inclusive ecosystem for semiconductor sourcing. "Intel Foundry’s advanced technologies and silicon-verified IPs in manufacturing and advanced packaging strengthens our delivery of innovative, accessible and diverse solutions to our mutual clients. This will also give them greater choice and flexibility in semiconductor sourcing," said Vijay Guntur, President, Engineering and R&D Services, HCLTech. HCLTech has worked with Intel for over 30 years. This collaboration has grown over

Ansys multiphysics solutions for signoff verification of advanced integrated circuits (ICs) designed with the Intel 18A process technology with new RibbonFET transistor technology and backside power delivery.  The predictive accuracy of Ansys’ power and signal integrity platforms helps designers lower the power consumption and increase the performance of edge artificial intelligence (AI), graphic processing, and advanced computing products by minimizing over-design. Collaboration towards a smooth electronic design automation (EDA) flow can significantly increase productivity for joint customers. Ansys RedHawk-SC and Totem are recognized as industry standards for power integrity signoff of digital and analog designs, respectively. The solutions’ cloud-enabled data infrastructure provides unparalleled capacity to analyze full-chip designs and multi-die assemblies. PathFinder uses the same elastic compute infrastructure to also verify the electrostatic discharge (ESD) protection circuitry found on all chips. The Ansys Raptor family models high-speed signals including on-chip electromagnetic coupling. “Intel Foundry and Ansys have partnered to ensure our customers have access

Graphisoft, the leading Building Information Modeling (BIM) software solution developer for architecture and multidisciplinary design, will reveal its performance test results of Archicad on the latest MacBook Pro in a February 27 webinar. As the first native BIM software solution for Mac and fully optimized on Mac from the beginning — native Apple Silicon support for Archicad means users can take advantage of Apple's latest hardware innovations. In October 2023, Apple revealed significant technological advances to the MacBook Pro and the 24-inch iMac featuring the M3 chip, resulting in a powerful and efficient workflow. The high-speed performance delivered by the combination of Archicad and Apple Mac devices promises to turbo-charge architectural design. Supercharged by the M3 family of chips,Apple showcased Archicadto demonstrate unprecedented speed and versatility on the new Macs. Power, where you need it mostGraphisoft will unveil the findings of the Archicad and Mac performance tests at an exclusive webinar on February 27 at 2 PM

NextLabs announced major enhancements to its SkyDRM product line, enabling uninterrupted collaboration across the extended enterprise. The enterprise digital rights management (E-DRM) solution uses attribute-based policies with zero trust principles to automate persistent protection of sensitive information at rest, in transit, and in use throughout the information lifecycle. The latest enhancements to SkyDRM build on its file-type agnostic capabilities, providing enterprise digital rights management (E-DRM) protection with the ability to enforce rights natively on any applications, such as PLM, CAD, and major enterprise applications such as SAP, iManage, and Microsoft Office. SkyDRM can also work with any OIDC and SAML identity providers and federated identities; its attribute-based access control (ABAC) policy can be applied to grant different permissions to users across multiple domains. Additionally, files uploaded to applications or file repositories via web application, desktop, or mobile server are automatically protected. As part of this latest update, SkyDRM is now certified