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Siemens Digital Industries Software announced it has collaborated with Intel Foundry to develop a comprehensive workflow for the foundry’s embedded multi-die interconnect bridge (EMIB) approach to in-package, high-density interconnect of heterogeneous chips. Leveraging the expertise and world class technology of Siemens' industry leading IC and PCB design portfolios, Intel’s EMIB technology delivers advanced integrated IC packaging solutions that cover planning and prototyping, all the way to enabling signoff across a broad range of integration technologies including FCBGA, 2.5/3D IC, and others. “We are providing our customers with highly innovative advanced packaging technology,” said Rahul Goyal, Vice President and General Manager, Product and Design Ecosystem, Intel Foundry. “Our collaboration with Siemens enables us to define a certified, production ready EMIB technology reference flow that we can deliver to our customers so that they can design efficiently and effectively.” With this new Intel Foundry workflow, mutual customers can tackle a range of critical tasks including

Siemens Digital Industries Software announced that its industry-leading Calibre® nmPlatform tool for integrated circuit (IC) design verification and its world-class Analog FastSPICE (AFS) platform for analog, radio frequency (RF), custom digital and mixed-signal circuit verification, are now both certified for Intel 18A and Intel 16 process technologies. Intel 18A is also now enabled with Open Model Interface (OMI), the industry-standard platform for enabling aging modeling and reliability analyses, supported by the AFS Platform. Intel 18A represents the latest advances on Intel Foundry’s process technology roadmap. With Siemens’ successful certifications for leading-edge Intel 18A, IC design engineers around the world can continue using their most trusted EDA (Electronic Design Automation) tools with confidence for tape-outs enabled by Intel Foundry’s highly advanced processes. Intel 18A node features Intel’s advanced RibbonFET Gate-All-Around (GAA) transistor architecture and PowerVia backside power delivery technologies that help customers optimize the density and performance of their next-generation products, including those

In his most recent instalment of his PLM series Peter Bilello discusses the differences between PLM, ERP, EAM, and other solutions. Peter says, “The main source of this confusion is that the enterprise-level solution providers edge closer to each other's capabilities with each release. In their pursuit to be competitive, their offerings have become so feature and function-rich that many look alike.” Read the full article here: https://www.engineering.com/story/whats-the-difference-between-plm-erp-eam-and-more To view the original press release, please click here.

Accenture has completed its acquisition of Insight Sourcing, a provider of strategic sourcing and procurement services, previously announced on February 13. Insight Sourcing broadens Accenture’s sourcing and procurement services for private equity firms and the consumer goods, retail, technology and industrial industries. The acquisition adds approximately 220 sourcing consultants to Accenture’s Sourcing & Procurement practice within its Supply Chain & Operations function. To view the original press release, please click here. Search for Accenture on CIMdata.com Search for Insight Sourcing on CIMdata.com

Altair, a global leader in computational intelligence, announced that Chip Colbert and Caroline Phares have joined Altair in leadership roles for two priority industry segments. Phares has been named vice president for healthcare and life sciences (HLS) and Colbert has been named senior director for Federal and Department of Defense (DoD), part of Altair’s aerospace and defense vertical. Both individuals bring decades of valuable experience that will further propel Altair’s industry efforts. “Chip and Caroline’s proven experience will further bolster our focus on high-growth industry segments, helping us expand Altair’s market share in segments where we have best-in-class technology, a strong track record of success, and a unique blend of talent,” said James R. Scapa, co-founder and chief executive officer, Altair. “Adding these two leaders is another demonstration of our commitment to investing in high-potential industries.” With more than 20 years of experience, Caroline Phares will elevate Altair’s presence and enhance its focus in the HLS

The Board of Directors of American Software, Inc. (NASDAQ: AMSWA), a leading provider of innovative AI-powered supply chain management and advanced retail planning platforms, announced today that the company’s co-founder, Executive Chairman and Treasurer, James C. Edenfield, has elected to step down from the Board and as the company’s Treasurer, after over 50 years of leadership for the company. Mr. Edenfield submitted a letter of resignation, which the Board accepted today. Mr. Edenfield will continue as an advisor to the company and its Board. Mr. Edenfield is an original co-founder of the company, dating back to 1970, when Mr. Edenfield and Dr. Thomas L. Newberry, IV, formed the predecessor to the company and served on its Board, with Mrs. Norma Edenfield and Mrs. Evelyn Newberry. Mr. Edenfield, together with Dr. Newberry, pioneered the development and use of manufacturing and distribution planning and execution software applications; which were foundational for the supply

In a journey spanning a quarter-century, ESTECO stands as a beacon of innovation in the world of technology. This year, we’re proudly celebrating our 25th anniversary, a milestone that marks our continuous commitment to technology, research and innovation. ESTECO was founded by three engineers as a spin-off of the University of Trieste in 1999, building on the knowledge they acquired during the European funded project ‘Frontier’. Our founding members, President Carlo Poloni, CTO Luka Onesti and Scientific Advisor Enrico Nobile have taken the company from university startup to global leader in engineering technology in under 25 years. It took countless ideas, encounters and collaborations to get us to where we are today. ESTECO is a big family that hasn’t forgotten roots and the long road travelled. You - our partners and customers - have been an essential part of our journey. We’ve grown steadily over the years and currently count over 150 employees worldwide, with branches

Flexxbotics, delivering workcell digitalization for robot-driven manufacturing, announced the appointment of accomplished manufacturing software executive, Marc Lind, as Chief Strategy Officer (CSO) and Chief Marketing Officer (CMO). The addition strengthens Flexxbotics’ leadership in the emerging field of robot-driven manufacturing for the smart factory. During his more than two decades at Aras, Marc Lind led global marketing, strategy and corporate development building the business into the disruptor of the enterprise product lifecycle management (PLM) market. He has a proven track record in the development and execution of high growth strategies for industrial SaaS solutions that scale recurring revenue and operations worldwide. Marc Lind’s accomplishments at Aras range from driving the ‘large deal size’ inbound go-to-market to leading successful strategic partnerships and multiple international acquisitions. He helped design and implement a capital strategy that spanned angel funding, venture capital, corporate strategic and private equity investments resulting in the most valuable pure-play company in the history

Intel Foundry Services (IFS) and Cadence Design Systems, Inc. announced they have expanded their partnership and entered into a multiyear strategic agreement to jointly develop a portfolio of key customized IP, optimized design flows and techniques for Intel 18A technology featuring RibbonFET gate-all-around transistors and PowerVia backside power delivery. Joint customers will be able to accelerate their SoC project schedules on process nodes from Intel 18A and beyond while optimizing for performance, power, area, bandwidth and latency for demanding AI, HPC and premium mobile applications. “We furthered our partnership with Intel Foundry Services through a significant strategic multiyear agreement to provide design software and leading IP at multiple Intel advanced nodes, thereby advancing Intel’s IDM 2.0 strategy and accelerating mutual customer success,” said Anirudh Devgan, president and chief executive officer at Cadence. “We’re very excited to expand our partnership with Cadence to grow the IP ecosystem for IFS and provide choice for customers,”

The Nemetschek Group, one of the leading software providers for the AEC/O and media industries, announced that it will further harmonize its portfolio: Three of the Groups brands, ALLPLAN, FRILO and SCIA (both part of Nemetschek Engineering), will use their strength of experience and expertise in the AEC industry to cover the entire design-to-build workflow even better by bringing the companies together under the umbrella of the larger ALLPLAN brand. Through the merger, ALLPLAN, a German-headquartered global provider of BIM solutions for the AEC industry, is not only enriching its portfolio but also solidifying its leading position as an expert in platform-based BIM solutions across the entire construction lifecycle. Meanwhile, for SCIA, based in Hasselt, Belgium, and FRILO, located in Stuttgart, Germany, this union spurs innovation and offers powerful as well as comprehensive end-to-end design-to-build workflows, with a strong focus on structural engineering. The collaborative effort also includes a new, unified go-to-market