Position Papers

Redstack has formed alliances with local partners Maptek and Avitus UAV Systems to deliver end to end reality capture, 3D scanning and 3D modelling solutions. With national headquarters in North Adelaide, Redstack is a provider of service and technology to engineering and architecture community. These new partnerships complement Redstack’s relationships with Autodesk, Apple and Makerbot, enabling Redstack to deliver end to end solutions for design, engineering and BIM professionals. Redstack Managing Director, Michael Lachs says “As a proud Australian company, we are very pleased to be partnering with leading Australian professionals in Maptek and Avitus. We are passionate about assisting Australian companies to grow and thrive in a global marketplace. Maptek and Avitus are just two of many South Australian success stories. We look forward to introducing their technologies to our clients throughout Australia and Asia Pacific.” Maptek is a provider of 3D scanning hardware. With more than 30 years of commitment to

Mentor Graphics Corp. announced that it has acquired Flexras Technologies, a leading developer of proprietary technologies that reduce time required for prototyping, validation, and debug of integrated circuits (ICs) and systems on chip (SoCs).  Flexras timing-driven partitioning technology will expand and strengthen the portfolio of tools available from Mentor to help engineers overcome the challenges of increasingly complex design prototyping. “We’re extremely pleased to have the Flexras team join Mentor Graphics,” said John Lenyo, vice president and general manager of the Mentor Design Verification Technology Division. “We’re committed to helping our customers reduce the risks and costs associated with design prototyping and Flexras has proven to be a visionary in this area.” Terms of the deal were not disclosed.

 PDF Key takeaways: As industry moves toward “up front” systems engineering, the use of optimization and probabilistic technologies will become increasingly important for choosing the “best” design to meet multi-domain system level performance requirements Altair’s physics-based simulation solvers all have a multi-physics capability with embedded optimization capabilities, they may also be run together in a co-simulation if that is required to better capture detailed physics Access to increased computational resources via both desktop and mobile devices connected to scalable cloud and high-performance computing (HPC) solutions will make it practical for more engineers to leverage performance modeling and simulation tools throughout the product development lifecycle As physics-based simulation becomes faster and more capable, companies are using it earlier in the product development process to solve more complex problems. Altair has dubbed its integrated solutions offering Smart Multiphysics. Each of Altair’s flagship solvers, OptiStruct®, RADIOSS®, AcuSolve®, and MotionSolve®, is a multi-physics code in its own right. But, each

Kalypso announces PLM Pulse for Oracle, the firm’s managed services for Oracle’s product lifecycle management (PLM) solutions, Oracle’s Agile PLM and Oracle’s Agile PLM for Process. Kalypso has provided companies with end-to-end Oracle PLM consulting and implementation services for over 10 years. Post go-live, a successful PLM program is highly dependent upon a stable environment and responsive user support. PLM Pulse for Oracle provides clients with the technical expertise and system support, administration and maintenance necessary to ensure optimal performance. “Recently, we have seen a growing need for specialized PLM technology support,” said George Young, CEO of Kalypso. “Rather than investing to develop this capacity internally, companies are finding that it is often more cost effective and operationally beneficial to outsource this function. As a result the decision to launch PLM Pulse for Oracle was driven by the urging of our mutual clients.” PLM Pulse for Oracle provides user administration, configuration changes, on-call issue resolution, proactive system monitoring, environment

Infor announced the availability of the next generation of Infor Fashion Product Lifecycle Management (PLM), an application developed to meet the specific requirements of the fashion industry. Infor Fashion PLM helps link the vital areas of merchandising (product development and sourcing) with line planning, design and development, sourcing and production. Since the original release of Infor Fashion PLM, Infor has delivered a new Merchandise Planning module and a new Partner Collaboration module to support additional processes in the areas of merchandising, product development and partner collaboration. The Merchandise Planning module supports the creation of new collections with overall budgets that can be allocated to product and market attributes as the collection and line plans evolve - streamlining processes. "The ability to compare and import budgets from external sources at the line level offers more efficiency and further streamlines the planning process," said Robert McKee, industry strategy director, Fashion, Infor. "During the development

ESI Group announces the latest release of its flagship software Virtual Performance Solution. A benchmark in the automotive industry, Virtual Performance Solution empowers manufacturers to evaluate and optimize product performance across multiple domains, so they can develop higher performance products at lower cost and in less time. By using one central simulation model, or 'single-core model' that can integrate all manufacturing properties and multi-domain simulation data, companies using Virtual Performance Solution can efficiently assess trade-off between different engineering domains. This ability is an important enabler of innovative product design and provides particular benefit for companies who must sustain high product performance as they adopt new, lightweight materials. Working on the same (single-core) model from end-to-end enables interactions between departments and supports faster design iterations; contributing to reduced development costs and time. Using a realistic Virtual Prototype early on in the design process helps manufacturing companies avoid costly late changes and reduces the number of real prototypes required to achieve a

The inclusion of a host of new and enhanced functionality in Alphacam 2015 R1 from Vero Software ensures manufacturers can compete in a global economy. The latest release is the largest ever delivered by the Alphacam development team and a release they are very proud of. The focus has been on helping manufacturers drive down costs, by speeding up their design and production processes, improving efficiency, productivity and profitability. A new advanced 5-axis machining module is introduced in Alphacam 2015 R1, which includes a comprehensive set of strategies with advanced tool axis control and intelligent collision avoidance, to quickly and accurately machine surface and solid models.  Alphacam General Manager Nick Spurrett says: “Incorporating the Moduleworks technology into Alphacam shows our commitment to the complex Advanced 5 axis market. The new toolpaths can also be analysed against the machine tool constraints using Alphacam’s 5-axis independent toolpath optimiser.” He says, a new ribbon bar interface

Lectra is pleased to announce that Starr Aircraft has chosen Lectra’s latest automated cutting technology and expertise to boost their production capabilities. Starr Aircraft has been a leading manufacturer of aircraft products for the global commercial aviation sector for more than 30 years; their product portfolio includes interior upholstery, curtains, carpet, and fire block fabricated goods. The combination of Starr Aircraft’s textile industry experience and their use of the latest technological developments allows them to manufacture customized parts with the speed and efficiency of a mass production process. “Recently, we have seen an increasing number of customers move to leather seating. In order to meet this rise in demand, we needed a solution that would double our capacity and allow room for continued growth, all without expanding our operational hours,” explains Tim DeWitt, Director of Product Sales and Development at Starr Aircraft. To help Starr Aircraft reach their production goals, Lectra has set

Shanghai Koito Automotive Lamp Co., Ltd., has selected Sigmetrix CETOL 6 Sigma tolerance analysis solution as an integral part of its robust design and quality production initiative. This program is committed to meeting the requirements of their customers. Shanghai Koito Automotive Lamp Co., Ltd. chose CETOL 6 Sigma and also entrusted the 3D tolerance analysis team of Cybernet China to work on a few projects. After several tolerance analysis projects were completed they could see the results from CETOL 6 Sigma were accurate and verified the resulting data in practice. Sigmetrix, LLC developed the seamless CAD integrated software CETOL 6 Sigma which helps the product design engineers at Shanghai Koito to improve and manage the quality level of the lamp assemblies with efficiency. “CETOL 6 Sigma can be seamlessly integrated with CATIA and simulate the real world assembly environment. For assemblies of automobile lamps, the effect of RPS errors, welding deviations and

ANSYS announced today that Fujitsu Limited is using its power noise and reliability solutions to create three-dimensional integrated circuits to meet performance requirements for next-generation high-performance central processing units. These chips leverage three-dimensional integrated circuit (3D-IC) architecture to gain power, performance and price advantages, but the configuration increases the design complexity and the challenges associated with power and thermal management. ANSYS®RedHawk™ and ANSYS®Sentinel™ provide Fujitsu with the ability to perform IR (voltage) drop, electromigration (EM) and thermal reliability analysis of its large processor designs by delivering full-chip capacity, fast turnaround time and production-proven sign-off accuracy. Finding the optimal floor plan for 3D-IC requires placement of through-silicon-via (TSV), as well as the power/ground network. This added complexity necessitates early-stage floor planning, analysis and debugging, as power and thermal issues become difficult to resolve later in the design process. Using RedHawk, Fujitsu can explore various TSV placement options to meet chips' power noise and reliability