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3D pioneer Browzwear and upstart Wink Software LLC will partner to demonstrate their integration of a 3D tool with an innovative view of effective workflow at the upcoming PI Apparel event on Jun 27-28 in New York. Wink Software will unveil its BeProduct™ Social Product Development (SPD) platform. This fresh new approach to leveraging cloud and social media technologies promises to improve the way fashion and consumer goods develop products by simplifying the user experience and enabling new levels of collaboration.

The latest innovation from longtime fashion systems developer and former Yunique Solutions Inc. founder Daniel Pak, BeProduct...

NGC Software today announced that Destination XL Group, Inc. (DXL) is implementing NGC’s EZ-Ship Scan/Pack Solution. DXL will use EZ-Ship to reduce chargebacks and packing errors by validating the contents of each carton and shipment sent from the retailer’s factories.

The retailer, who also utilizes NGC’s fashion PLM, is the largest omni-channel specialty retailer of big and tall men's apparel. DXL is planning to roll out EZ-Ship, a factory-level scan/pack solution with electronic data exchange (EDI), at a dozen factory locations.

DXL’s latest work with NGC builds on the success of its PLM implementation, which has...

Premier Farnell today announces that, together with its wholly owned subsidiary Celdis Limited, it has completed the sale of Cadsoft Computer GmbH (“Cadsoft”) and the assets used in connection with the sale of Cadsoft products in the US (together “the Business) to a subsidiary of Autodesk Inc. (“Autodesk”).

Cadsoft is a software development business that produces electronics design software that Autodesk will add to its software portfolio. Premier Farnell will continue to distribute the Cadsoft product on behalf of Autodesk.

This action follows an operational review, initiated in July 2015, which concluded that Premier Farnell would...

WISeKey, a Swiss based cyber security company, today announced plans to help secure Internet of Things (IoT) devices with SAP. The collaboration aims to allow the integration of WISeKey’s Managed Cryptographic Root of Trust secure IoT Edge Device with devices leveraging SAP HANA® Cloud Platform for the Internet of Things (IoT).

The collaboration will provide increased security of IoT devices when connecting to SAP solutions for the IoT. Having sensors connected to everything does not necessarily enable monetization or customer value. Companies and consumers can realize value and enable monetization when they can certify that they are receiving...

Synopsys, Inc. today announced a multi-year extension of its OEM agreement with Lattice Semiconductor Corporation for Synopsys' Synplify Pro® FPGA synthesis tools. With this agreement, Synopsys continues to be the exclusive provider of logic synthesis technology optimized for the highest quality of results, area and runtime for designers targeting Lattice Field Programmable Gate Arrays (FPGAs) and Complex Programmable Logic Devices (CPLDs).

"The extension of our long-standing relationship with Synopsys gives our customers continued access to a complete, easy-to-use synthesis design flow to implement and validate the rigorous timing and area requirements of next-generation designs," said Choon-Hoe Yeoh,...

Rescale is excited to announce a technology collaboration that provides Autodesk Moldflow software users the ability to run their simulations on the Rescale platform. Existing Autodesk Moldflow Insight software customers can access Rescale’s on-demand, high performance computing (HPC) platform in order to benefit from Rescale’s powerful and scalable hardware resources.

Rescale provides a highly secure, enterprise solution that enables companies to seamlessly accelerate their simulations with access to customizable, on-demand HPC resources available directly through a web browser. Rescale is a multi-cloud environment with more than 30 data centers globally providing a wide range of hardware offerings, including...

Roima has created a new Business Unit and broadened its services into Product Information and Lifecycle Management with the acquisition of Modultek, a Finnish market leader in the field. Modultek is headquartered in Pori, Southwestern Finland and has offices in Vantaa and Eindhoven, The Netherlands. Last year it had a turnover of 3,8 MEUR and employed 40 people. Roima has grown rapidly since 2014. After this merger the Company’s turnover has grown from 3 to 16 MEUR and from 35 employees to almost 150 in a little over two years.

This merger was the next logical step in Roima’s and...

aPriori will be holding its third annual European product cost management conference on June 27-29 at the International Conference Center in Stuttgart, Germany.  The event kicks off on Monday evening, June 27, with a Welcome Reception.  On Tuesday, June 28 and Wednesday, June 29, leading PCM practitioners from the UK, the Nordics, Germany, Switzerland, Austria, France, Italy and Spain will be joining together with Subject Matter Experts from aPriori to discuss new strategies and tactics for improving product profitability.

CIMdata’s Stan Przybylinski is amongst the featured speakers.

Registration and more info available by clicking here.

Materialise NV is pleased to announce the newest version of the Materialise Mimics Innovation Suite. This flexible platform of 3D printing software and services enables engineers and researchers to achieve rapid, reliable image segmentation and accurate 3D reconstruction using validated software. Users can now segment medical images faster with new intuitive tools such as a live 3D Mask Preview. Robust algorithms in the finite element analysis mesh preparation workflow allow the user to obtain high-quality meshes with more ease, even in challenging cases.

Segmenting anatomy from a CT or MRI scan is the most labor-intensive part in...

COMSOL, Inc. the leading provider of multiphysics modeling, simulation, and application design software, today announced the latest release of the COMSOL Multiphysics® and COMSOL Server™ simulation software environment. Hundreds of user-driven features and enhancements to COMSOL Multiphysics®, COMSOL Server™, and add-on products have been implemented with an emphasis on accuracy, usability, and productivity. From new solvers and methods, to application design and deployment tools, COMSOL® software version 5.2a expands the electrical, mechanical, fluid, and chemical design and optimization capabilities. 

Thermoviscous acoustics simulation solved with the domain decomposition solver. Local acceleration, total acoustic pressure, and total thermo-viscous power dissipation...

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