Trimble introduced today three new software versions of its Building Information Modeling (BIM) and analysis & design solutions for engineering and construction—Tekla Structures 2016, Tekla Structural Designer 2016 and Tekla Tedds 2016. The solutions provide enhanced collaboration and workflow efficiency for structural steel and precast concrete designers, detailers and fabricators, concrete contractors, general contractors and structural engineers.
Tekla Structures, the most advanced BIM software, makes accurate, constructible modeling of any steel or concrete structure possible. The new software version provides even more efficient modeling, allowing increased productivity by avoiding costly errors more easily in the fabrication and construction phases. The software...
SAP SE today announced the Internet of Things (IoT) foundation bundle for SAP HANA, which features device connectivity management capability from Vodafone and is designed to help customers gain returns on their IoT investments quicker.
The announcement was made at CeBIT 2016 being held March 14–18 in Hannover, Germany.
SAP and Vodafone have signed an agreement to collaborate on customer projects in all markets that they jointly serve. This collaboration aims to allow enterprises to connect and manage devices using Vodafone’s IoT connectivity platform and to collect and move data from the devices into the SAP HANA platform to...
CADLearning, a learning partner in the Autodesk community, has earned the status of Autodesk Authorized Publisher in the newly revamped publisher program. In the updated program, the Authorized Publisher Program (APP) designation has been awarded to a very select and small number of publishers in the Autodesk space. The designation means that CADLearning resources are now syndicated through the Autodesk Knowledge Network (AKN) and In-Product Help, making select content available at knowledge.autodesk.com and to Autodesk customers and trial users within select Autodesk products.
“Having worked with Autodesk as a publisher for more than a decade, we’re thrilled...
Manufacturers of advanced electronic products – ranging from mobile and networking appliances to futuristic Internet of Things devices – will become more powerful, smaller and more energy efficient thanks to new advances from TSMC and ANSYS.
TSMC's certification of ANSYS solutions for its 10nm FinFET process technology, enables customers to deliver their innovative and reliable products to market faster while minimizing design costs and risk. TSMC also certified ANSYS solutions for the latest 7nm design rule manual and SPICE model for early design starts. Additionally, ANSYS solutions are enabled for TSMC's Integrated Fanout (InFO), the advanced wafer-level packaging technology...
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