Bentley Systems, Incorporated announced that Leica Geosystems will incorporate Bentley’s Acute3D reality modeling software into its advanced oblique airborne imaging solutions for both unmanned aerial vehicles (UAVs) and piloted aircraft. Leica Geosystems, a leader in geospatial data acquisition and mapping products, has selected Acute3Dsoftware to generate full 3D “reality mesh” representations from its airborne photogrammetric imagery. This combination of software and hardware advancements will enable users to take full advantage of integrated 3D surveying and mapping.

Through reality modeling, observations of existing conditions are processed into representations for contextual alignment...

Aras^® today announced that Laird, a leading global manufacturer of systems that enable communications connectivity and protect electronics from electromagnetic interference and heat, has selected the Aras Innovator^® platform to streamline global product development and improve product visibility. Integrating to NX and Solidworks CAD, Altium ECAD, and the Laird ERP system, Aras Innovator will unify Laird’s product development, change management, and project management processes across seven business units worldwide.

Working with Aras Gold Certified Partner Razorleaf, Laird selected Aras Innovator for the platform’s flexibility to meet the distinct configuration needs of each business unit. PLM system flexibility is vital to...

WHO: The international EDA Consortium (EDAC), provider of services, market awareness and a common voice for EDA and IP suppliers to the global semiconductor industry, and its Emerging Companies Committee

WHAT: Will host a panel titled, "Patents and Patent Litigation -- Develop, Strengthen, and Protect Your Intellectual Property," featuring John Cabeca, newly named director of the Silicon Valley United States Patent and Trademark Office. Opening remarks will be made by San Jose's Mayor Sam Liccardo.

WHEN: Thursday, October 29,...

Siemens announced an expanded partnership with Georgia Institute of Technology (Georgia Tech), building upon a nearly two-decade relationship pursuing manufacturing innovation through software, conducting frontier-pushing research that supports digital product development, and preparing students to enter the science, technology, engineering and mathematics (STEM) workforce of the future.

 “Georgia Tech is one of the leading research institutions in this country, paving the way for new ideas and technologies to help redefine the way we manufacture goods, power our homes, travel through space and more,” said Eric Spiegel, president and CEO, Siemens USA. “Building upon our strong relationship, this comprehensive partnership will...

In cooperation with TraceParts, Rollon is now making their 2D and 3D CAD data available for free download. 
Rollon, one of the technological leaders in linear motion systems, including telescopic guides, linear guides and actuators, has always focused on delivering first class technical support to engineers in different applications such as industrial machines, railway, aerospace, logistics, special vehicles, packaging or medical. To further enhance its service to design engineers, Rollon has now partnered with TraceParts to offer them instant access to...

Nano-electronics research center imec and Cadence Design Systems, Inc.today announced that the companies completed the first tapeout of a 5nm test chip using extreme ultraviolet (EUV) as well as 193 immersion (193i) lithography. To produce this test chip, imec and Cadence optimized design rules, libraries and place-and-route technology to obtain optimal power, performance and area (PPA) scaling via Cadence® Innovus™ Implementation System. Using a processor design, imec and Cadence successfully taped out a set of designs using EUV lithography as well as Self-Aligned Quadruple Patterning (SAQP) for 193i lithography, where metal pitches were scaled from the nominal 32nm pitch down...

Cadence Design Systems announced the new Cadence Tensilica Vision P5 digital signal processor (DSP), its flagship high-performance vision/imaging DSP core. This imaging and vision DSP core offers up to 13X performance boost, with an average of 5X less energy usage on vision tasks compared to the previous generation IVP-EP imaging and video DSP.

The Tensilica Vision P5 DSP is built from the ground up for applications requiring ultra-high memory and operation parallelism to support complex vision processing at high resolution and high frame rates. As such, it is ideal for off-loading vision and imaging functions from the main CPU to increase...

Rand Worldwide today announces that itsIMAGINiT  Technologies division is releasing a new addition to the IMAGINiT Clarity family of products – Clarity Owner Data Portal (ODP). Clarity ODP combines the popular benefits of Clarity with powerful tools for organizations to distribute data to non-Revit users and integrate with enterprise facilities management software systems including ARCHIBUS.

“The findings from our recent ‘Insights into BIM and FM’ survey clearly pointed to a gap that needs to be bridged between BIM and facilities management,” says Joe Eichenseer, director of the Building Lifecycle Solutions team at IMAGINiT. “More than half of the building owners surveyed...

GRAITEC, an international BIM and CAD software developer for AEC, and Autodesk® Platinum Partner in US and across Europe, is delighted to announce its file collaboration and interoperability app for Revit, BIM Connect 2016, is now available as a free download directly from the Autodesk Exchange App Store.

This powerful, free extension for Autodesk® Revit® from GRAITEC provides bi-directional, intelligent Structural Building Information Modeling (BIM) model sharing, including the transfer of FEM results data, between GRAITEC Advance BIM Suite (Advance Design, Arch, SuperSTRESS, ...) and Autodesk® Revit® Architecture, Autodesk® Revit® MEP, Autodesk® Revit® Structure and Autodesk® Advance Steel products.

Sharing both the...

Tukatech, Inc., Los Angeles–based provider of award-winning apparel software and hardware solutions, has announced its most recent partnership with Indochine International Ltd., multi-national apparel manufacturer, headquartered in Hangzhou, China with locations within China, Vietnam, Cambodia, Sri Lanka, India, Bangladesh, and many apparel producing countries around the globe.

“Since the company’s launch in 2004, Indochine has aimed to be the leader in design, sourcing, and manufacturing, and has certainly continued that trajectory. Annual sales have grown from $15 million to more than $550 million in 2014, and Indochine is now aiming to reach $1 billion in annual sales...