Tukatech announced the release of TUKA3D 2015, the newest version of Tukatech’s 3D system for digital development from prototyping to eCommerce. “TUKA3D 2015 is the most advanced work that we have ever done in CAD/CAM technology. It should be called the 4D system, the fourth-dimension being the real-time motion simulation and live feedback,” says Ram Sareen, Founder and CEO of Tukatech.

TUKA3D 2015 is a thoroughly tested version with over 14 months of use in 27 different companies with different brands, products, and applications, resulting in a system that has helped eliminate physical sample making.

“Our biggest challenge has been working with...

RS Components today announced the expansion of DesignSpark Mechanical with two new optional premium modules that significantly extend the functionality of the existing version of the tool.

Developed in conjunction with SpaceClaim, the leading provider of flexible and affordable 3D modelling software for engineers, DesignSpark Mechanical is an advanced 3D direct modelling tool that can be downloaded free of charge. Notwithstanding the availability of these optional premium paid-for modules, which can now be purchased from RS, very importantly the fundamental software that is available today will remain free to all users with continued support, new versions and updates from RS into...

Granta Design has released version 3.1 of its MI:Materials Gateway software. This release, according to the company, has features that ensure materials choices can easily be access in the CAE environment and quickly identified.

Interoperability is supported for CAD systems such as CATIA, Creo, Autodesk Inventor, NX for CAE platforms like Abaqus, ANSYS Workbench and HyperMesh. Version 3.1 further enables users to share materials knowledge between product development functions.

MI:Materials Gateway allows CAD users to identify materials in the GRANTA MI database, assign them to parts and change materials assignments with CAE users. These CAE materials models can then...

C3D Labs is pleased to announce that ROSATOM, the Russian Federal Nuclear Center’s All-Russian Research Institute of Experimental Physics (VNIIEF) has licensed the C3D kernel for use in its 3D software.

After a selection procedure that thoroughly tested the contenders amongst available kernels, engineers at VNIIEF decided in favor of the C3D geometric kernel from C3D Labs. The technology will be used by the research institute to develop their own software that computes simulations of a variety of physical processes.

“We look forward to using the C3D geometric kernel to build computational meshes for 3D models, and for simplifying, adjusting, and improving...

CGTech is on hand at the National Leadership and Skills Conference (NLSC), June 22-26, 2015, to help grade multiple SkillsUSA/NIMS events related to Computer Numeric Control (CNC) machining. More than 16,000 people — including students, teachers and business partners — are participating in the weeklong event.

 The purpose of the CNC Mill, CNC Lathe and CNC Technician contests is to evaluate each contestant’s preparation for employment in CNC programming. In addition, it recognizes outstanding students for excellence and professionalism. The contest will assess the ability to write CNC programs, interpret prints, and measure/gage parts. Participants will also demonstrate theoretical knowledge of...

Gerber Technology is excited to announce that guest speakers Meg Munits, director of application development at Aeropostale, and Robyn Howard, senior PLM manager at Randa Accessories, will speak about the benefits of PLM for businesses at this year's PI Apparel 2015 Conference in New York on June 23 and 24. The annual conference attracts many of the world's leading fashion, apparel and footwear brands and executives. Over the two-day event, industry experts will discuss how modern technology can help address opportunities and challenges surrounding product lifecycles.

Meg Munits is a guest speaker for the session entitled, "How Can PLM Help Facilitate...

ESI Group, will attend the 10^th Teratec Forum at the Ecole Polytechnique in Palaiseau, June 23 & 24. A founding member of the organization, ESI has supported Teratec for the past decade. Today, Teratec plays a leading role in accelerating the developments of High Performance Computing in Europe. For this reason, ESI has chosen the Teratec Campus, near Paris, to host its new European HPC center which is due to open this summer.

In a highly competitive global context, European countries are engaging in digital strategies as a means to increase...

Autodesk, Inc. today announced that Amar Hanspal, Senior Vice President, IPG Product Group, will present at the Nasdaq Investor Program in London, Tuesday, June 30 at 2:45 p.m. British Summer Time. A live webcast, replay and podcast of the presentations will be available through Autodesk's Investor Relations Website atwww.autodesk.com/investors. Please go to the Website at least 15 minutes early to register, download and install any necessary software. For more information, please call Autodesk Investor Relations at 415-507-6705.

To view the original press release,...

3D Systems announced today that it will feature its versatile personal and professional 3D printers as well as its extensive digital design tools at the Design Engineering & Manufacturing Expo (DMS) in Tokyo, Japan, June 24 – 26, 2015. Located in the Tokyo Big Site Convention Center, booth E 2-36, 3DS will showcase its workflow-enhancing 3D digital thread, which allows clients in industries such as manufacturing, healthcare and architecture to move seamlessly between scanning, designing and 3D printing to compress design windows and shorten supply chains.

Together with its partners and resellers, 3D Systems will display the ProX^™ 200 Direct Metal Printer (DMP),...

Synopsys today announced its cooperation with National Taiwan University (NTU), National Cheng Kung University (NCKU), National Tsing Hua University (NTHU), and National Chiao Tung University (NCTU) to establish joint advanced design labs for Internet of Things (IoT) applications at the aforementioned schools. This is the first cooperation between a foreign semiconductor design software and IP company and top universities in Taiwan to focus on advancing IoT ecosystem business opportunities and research and development (R&D). The collaboration is expected to cultivate semiconductor design talent and advance relevant industry development.

Dr. Aart de Geus, chairman and co-CEO of Synopsys, came from the U.S. to attend the...