Industry Summary Articles

Cadence announced it is furthering its longstanding collaboration with TSMC to accelerate time to silicon for 3D-IC and advanced-node technologies through certified design flows, silicon-proven IP and ongoing technology collaboration. As a leading provider of IP for TSMC N2P, N5 and N3 process nodes, Cadence continues to deliver cutting-edge AI-driven…

Siemens Digital Industries Software announced that the company has deepened longstanding collaboration with TSMC to drive innovation in semiconductor design and integration, enabling mutual customers to tackle the challenges of next-generation technologies. Building on a series of recent collaborations, Siemens has achieved certification for its Calibre® nmPlatform software suite—including nmDRC, nmLVS,…

Synopsys, Inc. announced its ongoing close collaboration with TSMC to deliver robust EDA and IP solutions for TSMC's most advanced processes and advanced packaging technologies to accelerate AI chip design and 3D multi-die design innovation. Among the newest collaborations is availability of certified digital and analog flows on TSMC A16™…

Outbuild, a construction scheduling and planning software company, announced a new integration with Autodesk Construction Cloud®, a portfolio of software and services that combines advanced technology, a builders network and predictive insights for construction teams. This integration allows construction professionals to directly integrate their schedule into Autodesk® Build, eliminating the need to rely on…

IFS, the leading provider of enterprise cloud and Industrial AI software, has launched a new migration accelerator service, designed to help SAP customers move seamlessly and quickly from existing SAP systems to IFS Cloud and immediately start generating value from Industrial AI. With many SAP customers in the process of…

Through continued collaboration with TSMC, Ansys announced enhanced AI-assisted workflows for radio frequency (RF) design migration and photonic integrated circuits (PICs), and new certifications for its semiconductor solutions. Together, Ansys and TSMC facilitate optimized 3D integrated circuit (3D-IC) design and accelerate market readiness for AI and high-performance computing (HPC) chip applications.…

ALLPLAN, a leading provider of BIM solutions for the AEC industry, introduces a comprehensive service release with ALLPLAN 2025-1. The latest enhancements further streamline design-to-build workflows and strengthen cloud connectivity, enabling professionals across all disciplines to work faster and more precisely. "With ALLPLAN 2025-1, we are taking digital workflows to the next level.…

Capgemini announced an extended agreement with Team Penske to roll out its Sustainability Data Hub (SDH), further accelerating Penske’s position as a sustainability trailblazer in motorsports. Capgemini’s cutting edge platform will help enable Penske to streamline efficiencies in environmental reporting and unlock deeper insights to help reduce its carbon footprint. With Capgemini’s SDH, Team…

Robi Decking, a leading manufacturer of premium hardwood decking and architectural wood products, has announced a partnership with BIMsmith, the leading product research platform for building professionals, for the development of new Building Information Modeling (BIM) tools for architects, designers, and other building professionals. The partnership includes a set of…

Together with Koenig & Bauer, a global printing press manufacturer, technology company Siemens will accelerate development and commissioning processes for printing presses with a new machine automation platform. The standardized and modular automation platform enables machine building customers to create predictive maintenance models and performance dashboards for individual machine components.…