Industry Summary Articles

nTop, the leader in computational design software for high-performance engineering, announced the launch of nTop 5, the next generation of its flagship product, which includes major integrations from five new partners to its developer ecosystem. Materialise, Autodesk, Hexagon, Intact Solutions, and cloudfluid have all built nTop interoperability into their software…

Siemens Digital Industries Software announced a fully automated solution to help integrated circuit (IC) design teams rapidly identify and address Electrostatic Discharge (ESD) issues driven by the growing complexity of today’s next-generation IC designs, regardless of targeted process technology. Combining the power of Siemens’ Calibre® PERC™ software with the proven…

Siemens Digital Industries Software introduced Calibre® 3DThermal, innovative software for thermal analysis, verification and debugging in 3D integrated circuits (3D-ICs). Calibre 3DThermal enables chip designers to rapidly model, visualize and mitigate thermal effects in their designs from early-stage chip and package-inward exploration through to design signoff by incorporating elements of…

Siemens Digital Industries Software introduced Solido™ Simulation Suite software(“Solido Sim” software), an integrated suite of AI-accelerated SPICE, Fast SPICE and mixed-signal simulators designed to help customers dramatically accelerate critical design and verification tasks for their next-generation analog, mixed-signal and custom IC designs. Built on the foundation of Siemens’ industry-proven, foundry-certified…

Siemens Digital Industries Software announced Innovator3D IC™, new software that delivers a fast, predictable path for the planning and heterogeneous integration of ASICs and chiplets using the latest and most advanced semiconductor packaging 2.5D & 3D technologies and substrates in the world. Siemens’ Innovator3D IC provides a consolidated cockpit for…

Aspen Technology, Inc., a global leader in industrial software, announced a three-year partnership agreement with Oregon State University (OSU) that expands traditional academic collaborations focused on incorporating process simulation solutions into curricula by adding sustainability software, training and competency development. The partnership aims to help students build industry-ready skills and…

Velo3D, Inc., a leading additive manufacturing technology company for mission-critical metal parts, announced that its Board of Directors has formally appointed Brad Kreger, who has been serving as the company’s Interim Chief Executive Officer since December 2023, as the company’s permanent Chief Executive Officer. The Board of Directors cited the…

The Supervisory Board today approved the premature extension of Peter Schneck's contract. The Management Board contract, originally concluded for three years, has now been extended for a period of five years until 17 October 2029. Peter Schneck joined CENIT AG as a member of the Management Board on 18 October 2021…

Dassault Systèmes announced the appointment of Sabine Scheunert as Managing Director, EUROCENTRAL. In this role, Scheunert will drive the implementation of Dassault Systèmes’ corporate strategy across Austria, the Czech Republic, Germany, Hungary, Poland, Slovakia, Slovenia and Switzerland, focusing on strengthening business relationships and expanding the company’s footprint in the manufacturing,…

HCLTech, a leading global technology company, announced the opening of new offices in East Brunswick, New Jersey and Santa Clara, California, further strengthening its footprint in North America. The company celebrated the office launch in New Jersey with a traditional Indian ceremony, a community service activity with employees and a…