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Items filtered by date: May 2026 - CIMdata
Siemens announced Intelligence Center X, new industrial AI orchestration software designed to help organizations turn industrial AI from isolated experimentation into scalable, real world business impact through a hybrid workforce where people and AI agents work together with shared context, workflows and lifecycle intelligence. By connecting data, models and workflows on a single governed foundation, Intelligence Center X enables companies to deploy AI-driven applications and agents faster, with full traceability and control. Intelligence Center X combines the Mendix™ low-code platform with Siemens’ Graph Studio and AI Studio software from the Rapidminer® portfolio to create the enterprise context, business-specific lifecycle intelligence, and orchestrated agents and intelligent applications businesses needed to turn AI ambition into real value gains. Across industries, companies have invested in AI but are struggling to scale beyond pilots because data is fragmented, governance is inconsistent, and AI insight does not connect to real workflows. Intelligence Center X is designed
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DXC Technology, a leading enterprise technology and innovation partner, announced DXC Engineering, a distinct service offering and a foundational pillar of its Consulting & Engineering Services (CES) business. DXC Engineering is built on the 20-year digital engineering heritage of Luxoft—which DXC acquired in 2019—and consists of more than 11,000 highly specialized engineers delivering mission-critical solutions across Financial Services, Automotive, Manufacturing, Telecommunications, Energy and other industries. The new entity brings together three distinct capabilities: deep domain expertise, an industry-specific/AI partnership ecosystem, and Physical AI-enabled smart product design. DXC Engineering does not separate industry knowledge from technical execution, giving customers a single partner for the challenges that matter most. DXC builds solutions for customers that include a trading risk engine that can navigate real market volatility, an autonomous driving stack that meets functional safety standards, and a real-time telecom network platform that scales. DXC Engineering builds on these with focused investments to harness
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At Computex 2026, Cadence announced the industry’s first fully autonomous virtual agentic AI design engineer, extending the ChipStack™ AI Super Agent to Level-5 autonomy. Built on Cadence’s AI-driven electronic design automation (EDA) portfolio with NVIDIA Nemotron models, and secured by NVIDIA OpenShell runtime, the new agentic capabilities enable customers to run dynamic simulations in automated workflows. At NVIDIA, 1000s of engineers are using billions of compute hours per year to run millions of tests to verify their designs. Each engineer will use ChipStack agents to run hundreds of dynamic simulations with Cadence® Xcelium™ Logic Simulation and Jasper® Formal Verification, delivering over 40X faster RTL validation cycles and reducing a typical five-week verification loop to less than a day, dramatically accelerating the validation of complex semiconductor designs. “We see our customers using AI to let their expert engineers take on more ambitious silicon designs with greater speed and confidence,” said Paul Cunningham, senior vice president and
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BIMsmith, the leading platform for building product research and BIM content, announced the next evolution of Detail Shelf, featuring AI-powered search capabilities and expanded access to manufacturer construction details across a growing range of building product categories. The release improves how architects, engineers, and specifiers discover technical content by combining a significantly expanded detail library with intelligent AI search technology that understands detail attributes and context. Since its launch in 2020, Detail Shelf has helped design professionals access thousands of manufacturer-provided construction details. The enhanced platform released today builds on that success by increasing content availability and making it easier to navigate complex technical information through AI-driven discovery tools. “Construction details are among the most valuable resources manufacturers provide, but historically they've been difficult to find and organize at scale,” said Benjamin Glunz, CEO of BIMsmith. “We've expanded the amount of information available through Detail Shelf and paired it with AI technology that
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Use of the Industrial AI Cloud for secure automation The Scheer Group and Telekom subsidiary T-Systems have entered into a strategic partnership. The partnership aims to reduce dependence on international technology conglomerates and embed German and European values in their solutions. As part of the collaboration, Scheer PAS, a company within the Scheer Group, will use its Agentic Process Orchestration Platform to leverage the T Cloud Public and Industrial AI Cloud infrastructure in Munich. Seamless integration and control of AI agents Scheer IDS, another company within the Scheer Group, complements the partnership with comprehensive expertise in holistic business process consulting within the SAP environment. Through the structured analysis, harmonization, and transformation of business processes, it is ensured that AI initiatives and platform decisions are built on a robust technical and procedural foundation. At the same time, customers benefit from sophisticated AI and data services as well as access to powerful GPU resources for Telekom/T-Systems’ demanding AI applications. With the Agentic
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AlphaSTAR Technology Solutions, a leading provider of simulation technology for advanced materials and manufacturing processes, announced that it has partnered with Stratasys Ltd., the industry leader in providing complete polymer 3D printing solutions. Through this partnership, AlphaSTAR’s Toolpath Simulator will enable Stratasys customers to shorten design cycles and generate more precise, qualified builds, while reducing trial & error. With a presence in North America, Europe, Asia and over 200 channel partners worldwide, Stratasys has major manufacturing customers across the globe in aerospace, automotive, industrial, consumer, and energy sectors who can benefit from this functionality now housed inside GrabCAD Print Pro. AlphaSTAR’s Toolpath Simulator is available as a plug-in to the GrabCAD Print Pro software platform, which manages the print preparation process for Stratasys 3D printers and offers enhancements designed for manufacturers who need to efficiently produce end-use parts and move to production-scale volumes. By inserting toolpath-driven analysis into an FDM workflow, customers are able to
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Siemens has appointed Markus Grabmeier as the new Chief Executive Officer (CEO) of its Electrical Products (EP) Business Unit at Smart Infrastructure, effective June 1, 2026. He succeeds Andreas Matthé, who will remain available in an advisory capacity until his transition into retirement at the end of September 2026. Andreas Matthé had been with Siemens for more than 40 years, holding, among other positions, the roles of Vice President of Power Automation and Energy Management Systems at Siemens Ltd. in South Africa and Executive Vice President of Siemens Ltd. in China. From October 2010, he served as CEO of EP and its predecessor organization.  Markus Grabmeier has a long-standing career in the electrification industry. He was most recently a member of the Executive Management Committee of Alfanar, based in Riyadh, Saudi Arabia. Before that, he spent almost 14 years in various positions within Siemens. His career at Siemens began in Management
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Keysight Technologies, Inc. is collaborating with NTT DOCOMO, Inc. and NTT, Inc. to accelerate realistic 6G channel modeling and wireless communication simulation. The work is part of the companies’ ongoing memorandum of understanding (MoU) focused on 6G wireless communications design, testing, and measurement technologies. Initial milestones include progress in measurement driven channel modeling and distributed Multiple Input Multiple Output (MIMO) simulation, helping researchers evaluate next generation wireless concepts with greater confidence. As 6G research progresses, the industry is placing greater emphasis on understanding how wireless systems perform in complex real-world environments, including urban areas, indoor venues, and transportation corridors. Accurately reproducing these conditions remains challenging. Field testing can be expensive and difficult to repeat, while simplified lab models may not fully capture propagation effects that influence beamforming, mobility, and reliability. More realistic channel modeling and scalable simulation are becoming increasingly important for evaluating next-generation wireless architectures with greater confidence before deployment. In the
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Keysight Technologies, Inc. announced it has achieved a Hybrid eCall certification to the EN 18052:2025 standard from DEKRA. The validation reinforces Keysight’s commitment to standards‑based, real‑world‑ready test solutions that enable automotive manufacturers to navigate evolving safety regulations and accelerate time-to-market for next-generation connected vehicles.  As cellular networks transition away from legacy 2G and 3G infrastructure, automakers face mounting pressure to deliver compliant Next-Generation eCall (NG-eCall) implementations that utilize packet-switched 4G and 5G networks. Because regional network modernization moves at varying speeds, vehicles must operate reliably across mixed-network environments. Keysight’s certified Hybrid eCall solution addresses this challenge directly, enabling in-vehicle systems (IVS) to dynamically switch between legacy and NG-eCall systems based on real-world network availability. DEKRA’s validation confirms that Keysight’s end-to-end test solution successfully de-risks integration across the entire safety ecosystem—spanning the IVS, mobile networks, and public safety answering points (PSAPs). By building on Keysight’s previously achieved EN 17240 validation, this milestone ensures continuous
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Bechtle AG has joined the Responsible Business Alliance (RBA) as an affiliate member, supporting the vision and objectives of one of the world’s largest industry initiatives promoting social, environmental and ethical standards in global supply chains, with a focus on the electronics and IT sector. Bechtle is committed to gradually integrating the RBA’s Code of Conduct into its operations while ensuring that its direct suppliers comply with the Code’s requirements. The company’s membership in the Responsible Business Alliance reinforces the ESG (environmental, social and governance) objectives set out in Bechtle’s Sustainability Strategy 2030.  The Responsible Business Alliance Code of Conduct establishes standards to help ensure safe working conditions in supply chains and that business activities are conducted responsibly and ethically, with due regard for human rights and the environment. Its provisions are based on international norms and standards, including the Universal Declaration of Human Rights, the ILO’s international labour standards, the OECD
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