Commentaries & Highlights

Robin Systems today announced that USAA has deployed Robin Cloud Platform to power its Big Data infrastructure.  “We chose Robin Cloud Platform because it allowed us to simplify and automate how our analytic pipeline is managed,” said Eric Smith, USAA Chief Data and Analytics Officer. “Our Big Data infrastructure has been growing dramatically, and we needed a solution that made it easy to manage and scale these applications that was also consistent with our cloud roadmap. Robin checked all these boxes, and we have been very pleased so far with the efficiency and agility improvements achieved with their platform.” “It is an honor to be entrusted as the infrastructure platform for some of USAA’s mission-critical applications,” said Premal Buch, CEO of Robin Systems. “Robin Cloud Platform is now fully battle tested, certified and run in production scale. It is exciting to see growing adoption of our platform where customers start by adopting Robin for one

Dates: 07 Feb, 2018 - 07 Feb, 2018Location: Strathclyde University Technology and Innovation Centre Cowcaddens Road Glasgow - G4 0BA FARO is delighted to announce that we will be attending the BIM & Digital Transformation Scotland 2018 Conference. A full-day conference examining Scotland’s ‘digital revolution’ for the built environment, bringing together industry experts to discuss innovative ways to improve performance, efficiency, data management and reduce costs, as well as examine new technologies and subsequent impact across the public and private sectors.  To view the original press release, please click here. Search for FARO on CIMdata.com

Altair invites technical managers, R&D engineers, structural and mechanical engineers and everyone interested in simulation driven design methods to its "ATCx: L'Ottimizzazione guida la Progettazione ai tempi dell'Industry 4.0". The event takes place on February 20th, 2018 at the Università degli Studi di Padova - Polo Meccanico in Padova, Italy. In times of growing competitiveness and ever shorter development cycles, engineers face the challenge to develop better, lighter, and powerful components for increasingly complex systems and innovative products. A simulation driven design product development approach and optimization can lead the way to reach these goals while keeping development times down. With its focus on industry 4.0, the conference is dedicated to topics around thermal, CFD, structural simulation, and design for 3D printing and will feature presentations from Altair experts and a wide range of industry leaders. The event will introduce the most important innovative technologies available today and demonstrate how

Date: February 6, 2018 Location: Tinker Air Force Base Building 3001 – Patriot Room 3001 S. Douglas Boulevard Oklahoma City, OK 73130 USA  Modeling and Simulation is one of the key pillars of the USAF Digital Engineering Environment Initiative (DEE). As a partner in this DEE initiative, ANSYS offers a comprehensive software suite that spans the entire range of physics, providing access to virtually any field of engineering simulation that a design process requires. Please join us as ANSYS presents how Tinker scientists and engineers can improve design efficiency, drive innovation and reduce physical testing with physics based simulation in the areas of structures, fluids, electromagnetics, and systems. We will have a technical session on each topic, including demos and applications relevant to the Air Force Sustainment Center. Systems Overview As product complexity grows, so does the challenge of integrating the individual components in a system to ensure they work

SAP CEO Bill McDermott today announced a series of planned investments for SAP’s operations in France over the next five years to accelerate the company’s digital strategy and support France’s growing position as a hub of innovation. Signaling its continued support for France, SAP estimates a more than €2 billion spend over five years, intended to accelerate the company’s fast growth in the cloud and advance a technology community focused on machine learning (ML), blockchain, the Internet of Things (IoT) and software as a service (SaaS). The step reflects SAP’s global strategy – fueled by the SAP Leonardo digital innovation system – to help every organization become an intelligent enterprise. SAP will focus on startups that build solutions complementary to the SAP Leonardo system to foster fast collaboration and global scale. “There is a real sense of economic momentum in France,” Bill McDermott, CEO, SAP, said after a meeting with French President Emmanuel

Businesses risk missing major growth opportunities unless CEOs take immediate steps to pivot their workforces and equip their people to work with intelligent technologies, according to new research by Accenture.   The Accenture Strategy report, Reworking the Revolution: Are you ready to compete as intelligent technology meets human ingenuity to create the future workforce?, estimates that if businesses invest in Artificial Intelligence (AI) and human-machine collaboration at the same rate as top performing companies, they could boost revenues by 38 percent by 2022 and raise employment levels by 10 percent. Collectively, this would lift profits by US$4.8 trillion globally over the same period. For the average S&P500 company, this equates to US$7.5 billion of revenues and a US$880 million lift to profitability.   Both leaders and workers are optimistic about the potential of AI on business results and on work experiences, according to the study. Seventy-two percent of the 1,200 senior executives surveyed said

US-based Altair Engineering announces a collaborative effort with its partner in India, DesignTech Systems, and the Science and Technology Park, an institute supported by Dept. of Science and Technology (DST), Government of India, to support the advancement of the Govt. of India’s Skill India programme. The objective of this Skill enhancement programme by the Government, is to enable a large number of Indian youth to take up industry-relevant product design skill training that will help them in securing a better livelihood. The agreement to establish an Engineering Centre of Excellence (CoE) for research, innovation and skill building, is therefore expected to benefit a large community of students, Academic Institutes and overall Industry.  Speaking on the occasion of this technical collaboration, Shri. Dilip Band, President of Science and Technology Park, Pune says, “This COE is expected to complement current courses undertaken by the state institutions, aiming at bridging the gap

OPTIS today announces it will debut its SPEOS solution dedicated to the lighting industry, SPEOS Lighting for SOLIDWORKS, at SOLIDWORKS World 2018. This iteration of SPEOS, directly integrated into the leading CAD platform SOLIDWORKS, is a light simulation software based on the physical laws of optics that allows virtual prototyping of tomorrow’s lighting systems. The technology will be available for demonstration at SOLIDWORKS World 2018, the largest gathering of manufacturing and engineering professionals, taking place Feb. 4-7, 2018 at the Los Angeles Convention Center. In addition to allowing for the virtual design of the future product and controlling and understanding the behavior of light, SPEOS Lighting for SOLIDWORKS also offers the ability to test and validate the ergonomics of the future product in virtual reality. "Providing users of SPEOS Lighting for SOLIDWORKS with a virtual reality experience now allows us to address not only lighting manufacturers, but all trades, such

Mentor, a Siemens business, today announced a new e-commerce offering of its market-leading HyperLynx® design rule check (DRC) tool. To mitigate the pressure from adhering to layout guidelines from IC vendors and standard bus technologies while meeting EMI/EMC, safety and corporate routing standards, Mentor is offering a free version of the HyperLynx DRC tool, which includes eight design rules, at no cost to any PCB designer or hardware engineer. Design rule checking helps determine if the physical layout of a PCB or chip meets the minimum physical spacing and electrical requirements to reduce the likelihood of manufacturing or signal integrity (SI) or power integrity (PI) or EMI/EMC issues. Using built-in rules that can be parameterized, the user has immediate access to design verification technologies that are prevalent in the PCB design industry, without barriers to tool adoption. “Interconnects are no longer transparent in high-speed digital and mixed-signal products, and even

The next generation of ANSYS industry-leading engineering simulation simplifies workflows and ensures accurate results, enabling users to deliver revolutionary products while reducing costs and time to market. ANSYS®19 empowers engineers to develop groundbreaking products, from autonomous vehicles to smarter devices to more electric aircraft, at an unprecedented pace. Products are becoming more complicated as the digital and physical worlds continue to merge. Companies are faced with unrelenting pressure to drive innovation and increase product quality while reducing cycle times, costs and risk. ANSYS 19 helps engineers manage complexity and enhance productivity, empowering users to provide even more accurate answers across the broadest range of applications – making simulation even more pervasive. ANSYS 19 delivers enhancements across the entire industry-leading portfolio – from structures to fluids and from systems and semiconductors to electromagnetics. Long-time users will notice dramatic improvements in time to solution while new users can take advantage of state-of-the art functionality.