Nano Dimension Ltd. announced a strategic collaboration with HENSOLDT, a global security and defense electronics firm. Under this collaboration, HENSOLDT's engineers will work closely with Nano Dimension's engineering team to develop innovative applications for HENSOLDT's security and defense business.
HENSOLDT, which was one of the first companies in Europe to test and then purchase Nano Dimension's ground-breaking DragonFly Pro printer for printed electronics, already has printed hundreds of complex circuit boards using the DragonFly. Now, HENSOLDT will expand its use of the award-winning additive manufacturing solution with the aim of accelerating accessibility and adoption of electronics manufacturing, paving the way for the manufacture of products and components with integrated functionality -- better known as 3D structural electronics. The push for new products and components is largely being driven by the need for miniaturization and modularity in design.
The collaboration leverages Nano Dimension's market leadership in additive manufacturing of printed electronics and Hensoldt's advanced defense and security technologies. HENSOLDT currently uses the DragonFly Pro system at its company headquarters in Taufkirchen near Munich.
"Our focus is on providing our customers with the highest quality cutting-edge innovations," said Thomas Stocker, HENSOLDT's Head of Engineering. "By using the DragonFly, we've already accelerated our application development. Now, our strategic collaboration with Nano Dimension is further empowering our engineers in expediting product development cycles, while giving them the freedom to explore next-generation designs and solutions not possible with traditional manufacturing methods."
"HENSOLDT is doing some of the most advanced electronics work in the world, and we are delighted that our engineering team can help them lead the change in developing additive manufacturing in electronics and building the applications of tomorrow," said Amit Dror, CEO of Nano Dimension. "We expect to see great advances in electronics technology emerge through this collaboration."
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