IDEAS Digital Forum content explored the importance of simulation to analyze and optimize integrated circuit (IC) power, performance and reliability. Keynote and workshop speakers discussed how using high fidelity analysis solutions save designers time and increase efficiency through better estimations early in the design process.
The forum served as a hotbed for technical insights into how multiphysics is used to verify foundry sign-off for some of the biggest and most advanced chip design projects in the world. With 16 hours of content, the forum featured technical breakout tracks that delved into an array of topics and design styles, such as high-performance computing, high-speed analog, 2.5D/3D-IC packaging, power integrity, and low-power register-transfer level analysis.
IDEAS also featured two roundtable panel discussions. A technical discussion, titled "Beyond Moore," explored the duality of Moore's Law and newer techniques. The second panel discussion, "Women In Technology Accelerating Diversity and Inclusion," focused on the topic of diversity in the high-tech industry.
"Multiphysics analysis has become a pervasive requirement for advanced semiconductor designs," said John Lee, general manager and vice president at Ansys. "Ansys simulation is at the forefront of semiconductor enablement for the most cutting-edge technology, whether that's artificial intelligence and machine learning, high-performance computing, 5G or autonomous vehicles. The number of attendees and incredible speaker lineup are a testament to the power and value of Ansys solutions."
