Achronix Semiconductor Corporation (Achronix), a leader in high-performance FPGAs and embedded FPGA (eFPGA IP), leveraged Ansys’ multiphysics simulation to successfully signoff on its latest FPGA, the Speedster®7t AC7t1500 FPGA. Using Ansys, Achronix safeguarded the thermal reliability and power integrity of its latest programmable chip, which uses advanced 7 nanometer (nm) silicon technology. This technology delivers high-bandwidth performance for demanding processing workloads, including artificial intelligence (AI), machine learning (ML), and networking infrastructure.
Due to the amount of power packed into each high-performing chip, temperature control and sensitivity are essential to successful design. To ensure product performance and safety, Achronix used Ansys® RedHawk™ and Ansys® Totem™ to verify the power integrity and thermal reliability of the chip’s IP blocks, while employing Ansys® Pathfinder™ to analyze electrostatic discharge (ESD) circuits.
“Advancing to 7nm silicon process technology improves our device performance but also increases our need for multiphysics verification,” said Chris Pelosi, vice president of hardware engineering at Achronix. “As such, we rely on the fidelity and high capacity of the Ansys platform to provide us with access to a wide range of power, thermal, and reliability signoff checks for our Speedster7t AC7t1500 FPGA. We continue to trust Ansys’ solutions for additional projects, including our Speedcore embedded FPGA IP development.”
Ansys RedHawk, Totem, and Pathfinder are built on the Ansys® SeaScape™ big data analytics platform for electronic system design, which includes cloud execution on thousands of central processing unit (CPU) cores. This cloud-native architecture, coupled with CPU power, enables ultra-large, full-chip power analyses with high capacity and scalability.
“Developing the most advanced and sophisticated semiconductors requires the most advanced and sophisticated tools to accurately predict complex high-speed electronic and thermal effects,” said John Lee, vice president and general manager of the semiconductor, electronics, and optics business unit at Ansys. “Ansys’ broad multiphysics simulation portfolio, combined with our cloud-native platforms and optimization tools, consistently helps our customers enhance the design and performance of the most leading-edge semiconductor technology while reducing design risks and product failure.”
