Kontron, a leading global provider of IoT/Embedded Computer Technology (ECT), announces the development of a COM-HPC Mini module based on the COM-HPC 1.2 specification approved by PICMG on 6 October 2023.
With the ratification of the COM-HPC 1.2 specification to COM-HPC Mini, PICMG has significantly extended the high-performance standard. Customers now benefit from the broad scalability of the standard, offering new application possibilities.
The COM-HPC Mini module measures only 95 mm x 70 mm and thus complements the COM-HPC standard with a more compact format compared to the COM-HPC client and server formats. With a high-speed connector of 400 pins, including two 10 GbE interfaces and 16x PCIe lanes that support up to PCIe Gen5, as well as 4 USB 4 interfaces, including Thunderbolt and DisplayPort Alternate Mode, the increasing requirements for high-speed IO interfaces are now being taken into account also in the small form factor segment.
Kontron is developing a COM-HPC Mini module based on the next generation Intel® CoreTM technology, thus providing a solution with the highest possible performance in a compact and space-saving format for compute-intensive applications as well as demanding control and visualization tasks with minimal space requirements.
With the expansion of Kontron's wide range of COM-HPC implementations in various performance levels and functionalities, the perfect module can now be selected to match the requirements of the individual IIoT application.
"COM-HPC Mini enables the integration of ultra-high-performance COMs in the smallest application areas. It is crucial that the technical possibilities of the Intel® Next Gen CoreTM platforms can be fully utilized," explains Irene Hahner, Product Manager COM-HPC Modules at Kontron.
