Keysight Technologies, Inc. and Siemens EDA have teamed up to accelerate the efficiency of wireless and defense system design. The integration between Keysight’s Advanced Design System (ADS) and the Siemens Xpedition Enterprise suite of EDA tools enables engineers to more efficiently co-design digital systems and radio frequency (RF) circuits by performing layout and manufacturing in Xpedition and RF Circuit and electromagnetic simulation in Keysight ADS.
Today’s complex wireless and defense system designs demand unprecedented levels of integration between RF and overall system design. These advanced solutions often combine intricate RF components, high-speed digital circuits, and sophisticated signal processing, all of which must work harmoniously.
The collaboration builds on the prior dynamic inter-tool integration from Keysight and Siemens EDA that enabled system design to have bidirectional integration with RF and microwave engineering tools. This initiative integrates complete hierarchical designs bidirectionally between Keysight ADS and Siemens Xpedition Designer and Layout, eliminating the cumbersome and error-prone task of manually translating libraries between the tools.
Engineers can now seamlessly transition between detailed RF design in ADS and system-level design in Xpedition, maintaining integrity across the entire development process. This is crucial for optimizing performance in areas including 5G/6G communications, advanced radar systems, and electronic warfare applications, where the interplay between RF and digital domains is critical to system performance.
The new product is included in Keysight Advanced Design System 2025 and Siemens Xpedition Enterprise release 2409.
Nilesh Kamdar, EDA Design & Verification lead at Keysight said:“We have a long-established track record collaborating with Siemens to support customers in enabling the next generation of wireless design. The bidirectional integration allows engineers to optimize performance across various applications, including 5G/6G and radar systems.”
AJ Incorvaia, Senior Vice President, Electronic Board Systems, Siemens Digital Industries Software said: “As engineering teams strive to achieve digital transformation, the digital thread between RF and electronic system design becomes more critical. We’re pleased to announce improved integration enabling concurrent design to optimize system performance and improve quality while accelerating design closure.”
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