Dassault Systèmes will showcase the future of connectivity and industrial artificial intelligence at Mobile World Congress in Barcelona, March 2-5, 2026. The company’s 3D UNIV+RSES are redefining how connected industries create, produce and manage the life cycle of high-performance data centers, semiconductors, 5G networks and autonomous systems to build a smarter, more resilient and sustainable world.
In Hall 4 - Stand 4B25, immersive virtual reality experiences, avatars, autonomous robots, spatial computing and connected objects will reveal ways in which AI and virtual twins combine to move products, operations and business models from pilot to scale. Professionals across research and development, engineering, manufacturing and business transformation will discover strategies to master complexity, improve efficiency, innovate, and accelerate digital transformation through virtual creation, experimentation and validation. Highlights include:
- Optimized networks in an AI-generated city: an immersive, VR experience with virtual twins integrating product, infrastructure and environmental intelligence steps into a real-time inspection, diagnostics and repair workflow to ensure safer, more resilient and efficient connectivity.
- Transformed data center planning, creation and operation: spatial immersion with virtual twins explores data center layouts, airflow behavior and equipment placement to validate decisions, reduce risk, and optimize performance - before construction and throughout the life cycle.
- Virtual and real robots: a hands-on experience pairing Dassault Systèmes’ 3DEXPERIENCE platform with Westwood Robotics’ THEMIS robot demonstrates the virtual design, engineering and validation of complex robotic behaviors before they reach the real world.
In addition, Dassault Systèmes executives will share insights and expertise during two “Manufacturing and Production Summit” panel discussions:
- March 2, 14h15-15h30 CET: “Digital Danger - Tackling New Threats in Industrial Transformation” with Florence Verzelen, Executive Vice President, EMEA.
- March 2, 15h45-17h00 CET: “AI in Overalls - Scaling Intelligence Across the Industrial Value Chain” with Stéphane Sireau, Vice President, High-tech Industry.
