Siemens announced that its Calibre® nmPlatform tool for integrated circuit (IC) design verification and its Solido™ Simulation Suite for analog, custom digital and mixed-signal circuit verification, are now certified for Intel 14A and Intel 18A-P process technologies.
The Calibre® nmPlatform software certifications for Intel’s processes include Calibre nmDRC, Calibre nmLVS, Calibre PERC and Calibre YieldEnhancer product lines. In addition to the certification of Solido SPICE and Analog FastSPICE (AFS), both part of Solido Simulation Suite software, they are now enabled with Open Model Interface (OMI), the industry-standard platform for aging modeling and reliability analysis. Further, AFS is now enabled through Intel’s Custom Reference Flow (CRF).
Siemens and Intel Foundry have also collaborated to provide a digital workflow for Intel's advanced packaging technologies, including Embedded Multi-die Interconnect Bridge (EMIB) and Embedded Multi-die Interconnect Bridge-T (EMIB-T) featuring through-silicon vias (TSV). This enables engineers to seamlessly design, prototype and verify multi-chiplet architectures, using a comprehensive suite of Siemens’ design and verification products.
With Siemens’ certifications for Intel Foundry’s leading-edge Intel 14A and Intel 18A-P processes, IC and system level design engineers around the world can continue using their most trusted electronic design automation (EDA) tools with confidence for tape-outs enabled by Intel Foundry’s highly advanced processes, leveraging their versatility, power efficiency and optimized performance.
“To compete in this AI era, designers must accelerate innovation. Collaborating with world-class ecosystem partners such as Siemens is central to Intel Foundry's commitment to offering predictable execution on our next-generation technologies from silicon to packaging,” said Shawn Han, senior vice president & general manager, Foundry Services, Intel Corporation. “The certification of Siemens' verification solutions for Intel Foundry’ advanced process and packaging technologies helps customers bring their ambitious, differentiated products to market with greater speed, confidence, and efficiency."
"As semiconductors continue to shape the global economic landscape, Intel's dedication to the foundry market, as exemplified by Intel Foundry, provides another critical source for highly advanced manufacturing capabilities,” said Ankur Gupta, executive vice president, EDA IC Portfolio, Siemens Digital Industries Software. "Siemens takes pride in extending its EDA collaboration with Intel, providing a platform for our mutual customers to choose from a diverse spectrum of advanced processes and options for their next-generation semiconductor designs."
