MSC Software Corporation today announced that a new version of Digimat, the leading nonlinear multi-scale material and structural modelling platform from e-Xstream engineering, an MSC Software Company, features added grades from Trinseo (former Styron), a global materials company and manufacturer of plastics, latex and rubber. The material modelling data stored in the database helps engineers investigate and predict the behavior of composite materials. These are used, for example, to replace metal parts. Digimat now offers data on Trinseo grades PULSE™ 630GF, PULSE™ 979, VELVEX™ 5250 and the ENLITE™ PP LGF 6002 and ENLITE™ ABS Alloy LGF 6001 structural polymers.
“Digimat enables engineers to accurately predict mechanical behavior of parts made of our fibre filled thermoplastics as it takes the anisotropy due to the fibre orientation and the fibre length distribution into account. Therefore we have decided to characterise our fibre filled thermo plastics and make them available in the Digimat-MX database. Besides our short glass filled PULSE™ PC/ABS grades and our reinforced elastomeric resin VELVEX™, we have also added our recently launched ENLITE™ structural polymers. The latter are long glass fibre filled PP and ABS concentrates which can be diluted to a wide range of glass level in the end product. Especially when it comes to saving weight in modern vehicles, these materials play a key role in the replacement of metals,” said Gerhard Slik, Sr. Development Specialist, Application Engineering and Design Centre, Trinseo.
Due to the inherent relationship between vehicle mass and its fuel consumption, weight reduction of cars is a key area to address in order to meet the efficiency requirements. To overcome these challenges, design engineers need to have quick access to material information regarding performance at various strain rates, temperatures, and other key property measurements.
“Digimat-MX now contains information on Trinseo grades to address engineering and end-user composite modelling needs while minimizing component weight, cost, and time-to-market,” said Guillaume Boisot, Business Development Manager, e-Xstream engineering.
