Continuing its tradition of promoting and recognizing printed circuit board (PCB) design excellence, Mentor Graphics Corporation (NASDAQ: MENT) today announced the winners of its 26th annual PCB Technology Leadership Awards. Started in 1988, this program is the longest running competition of its kind in the electronic design automation (EDA) industry. It recognizes engineers and designers who use innovative methods and design tools to address today's complex PCB systems design challenges and produce industry-leading products.
Prominent experts in the PCB industry judged entries from around the world in six categories that represent a wide variety of industries:
- Consumer electronics and handheld
- Industrial control, instrumentation, security and medical
- Military and aerospace
- Computers, blade and servers, memory systems
- Telecom, network controllers, line cards
- Transportation and automotive
The expert judges included Michael R. Creeden, San Diego PCB CEO and founder; Gary Ferrari, FTG Circuits technical support director; Rick Hartley, RHartley Enterprises principal engineer; Steve Herbstman, SHLC founder and lead designer; Happy Holden, Gentex Corporation (retired); Andy Kowalewski, Metamelko LP senior interconnect designer; Pete Waddell, president of UP Media and publisher of Printed Circuit Design & Fab/Circuits Assembly Magazine; and Susy Webb, Fairfield Nodal senior PCB designer.
2015 Technology Leadership Award Winners
Category: Best Overall Design
Company: Abaco Systems Ltd.
Design team: Jim Rose, Zeshan Hussain, Eric Mills, Peter Woodruff
Using: Xpedition® Enterprise
Category: Computers, Blade & Servers, Memory Systems
1st place: Adcom
Design team: Moshe Frid, Elad Marciano, Alon Kukliansky
Using: Xpedition Enterprise
2nd place: Seagate Technology LLC
Design team: Keith MacLean, Andre' Dutko
Using: Xpedition Enterprise
Category: Consumer Electronics & Handhelds
1st place: Qualcomm Technologies Inc.
Design team: Bryan Selby, Scott Moyes
Using: Xpedition Enterprise
2nd place: LG Electronics
Design team: Kyu-seon Ahn, Sang-geun Kim, Sang-don Kim
Using: Xpedition Enterprise
Category: Industrial Control, Instrumentation, Security & Medical
1st place: Keysight Technologies
Design team: Michael Villaruel, Ryan Carlino, Steve Draving, Don Logelin, Lewis Dove, Nick Fernandez, Jeanne Snow
Using: Xpedition Enterprise
2nd place: Sintecs BV
Design team: Tom Berends, Paul ten Wolde, Wouter Stapper, Henk Mengerink, Maarten Tettero, Andrei Tuturou
Using: Xpedition Enterprise
Category: Military & Aerospace
1st place: BAE Systems – Electronic Systems – Rochester (UK)
Design team: Tim Chapman, Tim Rotter, Steve Mann, Peter Frid, Jack Silson
Using: Xpedition Enterprise
2nd place: ASELSAN MGEO
Design team: Umur Akıncı, Cenk Erim, Ahmet Mert, Emre Akdemir, Serap Sarıkavak, Recep Kızılkaya, Alper Akca, Kazım Yumbul, Cihan Aslan, Ozan Tekdur, Seda Karatekin, Sezer Yıldız, Halil İbrahim Yaşlak
Using: Xpedition Enterprise
Category: Telecom, Network Controllers, Line Cards
1st place: Coriant Oy
Design team: Sauli Kunnas, Hannu Saarikoski, Paavo Perälä, Sami Jokinen, Jyrki Vuorinen, Jycke Sulka-aho, Leo Haapavuo, Jyrki Nyyssönen, Päivi Vallin, Juha Ahvenainen
Using: Xpedition Enterprise
2nd place: Nokia
Design team: Markus Välkky, Olli-Antti Laine, Pekka Kähkölä, Ari Oinas, Jarmo Leskelä, Janne Toppila
Using: Xpedition Enterprise
Category: Transportation & Automotive
1st place: Visteon Corp.
Design team: Sadeesh Ramachandran, Nagarajan Mani, Ankita Karambelkar, Srikumar
Using: Xpedition Enterprise
2nd place: Visteon Corp.
Design team: Sadeesh Ramachandran, Niyazahmed Attar, Nagarajan Mani, Sowrirajan Senthil Kumar
Using: Xpedition Enterprise
The on-demand webinar highlighting industry trends and the winners of the 2015 Technology Leadership Awards competition will be posted shortly at www.mentor.com/go/tla.
The TLA contest is open to any designs created with Mentor Graphics® PCB solutions. Judging is based on design complexity and overcoming associated challenges, such as small form factor, high-speed protocols, multi-discipline team collaboration, advanced PCB fabrication technologies and design-cycle time reduction.
