ESI Group signed a Memorandum of Understanding (MoU) with Huawei, a global information and communications technology (ICT) solutions provider. The signature ceremony took place during the event HUAWEI CONNECT 2016 in Shanghai, China on September 1, 2016. The two parties will collaborate on High-Performance Computing (HPC) and cloud computing to provide innovative industrial manufacturing solutions for customers in China and worldwide. They also jointly released a white paper on the Huawei HPC platform-based ESI Virtual Performance Solution (VPS), a leading software solution used by industrial OEMs and their suppliers in order to test virtually all aspects of their product performance, including crash and safety. Often demanding large simulation models to achieve high levels of precision and predictive capabilities, VPS users greatly benefit from Huawei`s robust and efficient IT platforms, and the work done by Huawei and ESI to optimize the way their products work together.
Also a focus at HUAWEI CONNECT 2016 and important to the collaboration between Huawei and ESI, ESI`s virtual reality solution, IC.IDO, enables the Huawei HPC platform to provide customers with digital equipment room layouts that are of a 1:1 proportion to those of the physical environments. Leveraging the virtual reality technology, designers can keep improving virtual prototypes during product R&D to reduce the need for physical prototypes, which results in a dramatic reduction in design costs and shorter product development cycles.
The MoU signed by the two parties includes multiple cooperation plans. One is to build a joint innovation center in Munich, Germany to enable the two parties to validate innovative cloud computing and HPC solutions based on ESI`s industrial simulation test applications and Huawei`s leading IT products and platforms. Another is to build a global experience center in Hangzhou, China that will allow customers to experience the latest products and service training sessions. The two parties also agreed to initiate a series of cooperation projects worldwide to jointly promote and deliver innovative cloud computing, HPC product R&D, simulation, and data analytics solutions. All these cooperative efforts will provide global customers with innovative R&D technologies to help them address challenges brought by the ongoing exponential growth of ICT technology.
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