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Accenture reported financial results for the fourth quarter and full fiscal year ended August 31, 2025. Click to Download To view the original press release, please click here. Search for Accenture on CIMdata.com
Honeywell will issue its third quarter financial results before the opening of the Nasdaq Stock Market on Thursday, October 23. The company will also hold a conference call at 8:30 a.m. EDT. Presentation Materials / Webcast Details A real-time audio webcast of the presentation can be accessed at https://www.honeywell.com/investor, where related materials will…
Planera, the leader in visual CPM-based construction scheduling, announced that AMLI Residential, a leading multifamily developer, general contractor, and property operator, has selected Planera to streamline scheduling and boost collaboration across its construction projects. Challenge: Outdated, Siloed Scheduling ToolsBefore adopting Planera, AMLI relied primarily on Microsoft Project to manage its…
Merck and Siemens have signed a new Memorandum of Understanding (MoU), extending their strategic partnership to accelerate digital transformation in the life science industry by connecting digital and physical products. The agreement focuses on delivering integrated software solutions, systems and consumables that harness automation, data and AI to connect drug…
Centric Software® is proud to share the success story of Wild Foods, a fast-growing Chilean healthy food brand that has embraced digital transformation to fuel international expansion. Centric Software provides the most innovative enterprise solutions to plan, formulate, develop, procure, manufacture and sell consumer goods products in food & beverage, grocery,…
Cadence announced major advancements in chip design automation and IP, driven by its long-standing relationship with TSMC to develop advanced design infrastructure and accelerate time to market, for AI and HPC customer applications. Cadence and TSMC have collaborated closely across the spectrum from AI-driven EDA to 3D-ICs to IP and…
Cyncly, the world’s leading global provider of software and content solutions that help make amazing spaces for living, announced the release of On-Demand Content in Worksheet, a major update that simplifies catalog updates for both manufacturers and dealers. With this update, Worksheet users can now access catalog updates directly within their…
Siemens Digital Industries Software announced that it is collaborating with Advanced Semiconductor Engineering, Inc. (ASE), the leading global provider of semiconductor manufacturing services in assembly and test, to develop 3Dblox-based workflows for the ASE VIPack™ platform using Siemens’ Innovator3D IC™ solution, which is fully certified for the 3Dblox standard.. Siemens…
At the 2025 TSMC North America Open Innovation Platform® (OIP) Ecosystem Forum, Siemens Digital Industries Software announced multiple new collaborations with TSMC, including product certifications and innovative design solutions enablement initiatives for the foundry’s newest and most advanced process technologies. Mutual customers can now leverage these advancements, which include substantial innovations…
Synopsys, Inc. announced its ongoing close collaboration with TSMC to deliver multi-die solutions, encompassing advanced EDA and IP products, that support TSMC's leading-edge processes and packaging technologies, driving innovation in AI chip and multi-die design. The 3DIC Compiler exploration-to-signoff platform and IP, tuned for 3D packaging, along with the company's partnership…
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