Industry Summary Articles

Synopsys, Inc., announced TSMC has certified the Ansys portfolio of simulation and analysis solutions, enabling accurate final checks on chip designs targeted for TSMC's most advanced manufacturing processes including TSMC N3C, N3P, N2P, and A16™. The companies also collaborated on an AI-assisted design flow for the TSMC-COUPE™ platform. Together, Synopsys and TSMC…

ESTECO is pleased to announce the agenda for the 9th edition of the biennial ESTECO Users’ Meeting North America, taking place on October 14-15, 2025, at Saint John’s Resort in Plymouth, MI. This year’s event features prominent speakers from leading companies such as Cummins, SLB, Honda Development & Manufacturing of…

At the Bluebeam Unbound Conference, IMAGINiT Technologies, a division of Rand Worldwide and a Bluebeam Platinum Partner, will showcase its latest field-to-office workflow innovations. The conference, taking place September 30–October 2, 2025, in Washington, D.C. features IMAGINiT experts who will challenge architecture, engineering, construction firms and owners to rethink collaboration, redefine project…

MathWorks, the leading developer of mathematical computing software, will exhibit at the upcoming European Microwave Week (EuMW) 2025 in Utrecht, Netherlands. EuMW is Europe’s premier microwave, RF, wireless, and radar event, bringing together thousands of engineers, researchers, and industry leaders. Attendees are invited to visit MathWorks at Booth A094 to…

Rockwell Automation, Inc., the world’s largest company dedicated to industrial automation and digital transformation, will showcase its end-to-end autonomous manufacturing solutions at PACK EXPO 2025 in Las Vegas Sept. 29 – Oct. 1.  Amidst shifting consumer demand and evolving regulations, Rockwell will demonstrate how it helps CPG manufacturers extend autonomy from…

Alphawave Semi, a global leader in high-speed connectivity and compute silicon for the world’s technology infrastructure, announced the successful tapeout of the industry’s leading 64 Gbps UCIe™ die-to-die (D2D) IP subsystem on TSMC’s 3nm process technology. Building on its 36 Gbps Gen2 silicon success, this third-generation subsystem delivers a major…

Aurigo Software, North America’s leading capital planning software provider, announced a fully integrated solution that brings together Aurigo’s capital planning product with Autodesk Construction Cloud®, a comprehensive construction management solution that connects workflows, teams, and data across every stage of a project, from design and planning through building and operations. The new integration enables Autodesk’s facility owner and operator customers to…

Cyncly, the world’s leading global provider of software and content solutions that help make amazing spaces for living, announced a partnership with Leap SalesPro, a leading in-home sales platform for remodelers and home improvement contractors. Manufacturers publishing products to FeneVision WEB can now sell products directly through distributors using Leap…

Emerson, an industrial technology leader delivering advanced automation solutions, has introduced Guardian™ Virtual Advisor, an AI-powered software solution to support end-to-end lifecycle management. Emerson’s Guardian Virtual Advisor combines AI with deep domain expertise to help customers rapidly evaluate and enhance the performance of their automation systems, driving smarter decisions and operational…

ENCY Software announced the market release of ENCY Hyper, the company’s next-generation system for programming and simulating industrial robots and auxiliary equipment. ENCY Hyper blends the flexibility of offline programming with the responsiveness of real-time methods in a streamlined workflow designed for tablets and industrial PCs. The product will be officially…