News

Global automation leader Emerson introduced new Ovation™ AI Agents for the power and water industries, expanding the AI capabilities of the Ovation Automation Platform 4.0 release. The five new agents – Sequence Assistant Agent, Alarm Insight Agent, Predictive Maintenance Agent, Root Cause Agent and Loop Performance Monitor Agent – will empower plant personnel with critical insights by continuously monitoring, analyzing and recommending actions across critical plant operations. This expansion builds on the success of Ovation Virtual Advisor and delivers new capabilities to Ovation’s growing portfolio of AI solutions for the power and water industry, transforming how operators make decisions. While Ovation Virtual Advisor provides real-time, AI-driven insights through natural language interaction, the new AI Agents are time synchronized with the Ovation 4.0 system and work autonomously in the background, continuously monitoring plant and equipment conditions and recommending optimizations. "Ovation AI Agents deliver a major step change in our AI portfolio, representing a significant advancement in how

Infosys, a global leader in AI-first business consulting and technology services, announced the successful migration of NTN Corporation’s on-premise SAP Commerce-based e-commerce platform, e-WINGS, to SAP Commerce Cloud 2211. NTN Corporation is among the world’s leading manufacturers of precision equipment, including bearings. Powered by Infosys’ proven methodologies, accelerators, and comprehensive SAP Commerce expertise, and leveraging Infosys Cobalt, a comprehensive set of services, solutions, and platforms that help enterprises accelerate their cloud journey, the migration of NTN’s on-premises e-commerce platform was executed swiftly, ensuring seamless business continuity. The transformation delivered tangible benefits for NTN Corporation, including streamlined maintenance by automating version control, enhanced reliability in daily operations, and improving cost efficiencies by enabling cloud adoption. With scalable, cloud-based architecture now in place, NTN is well-positioned to pursue digital growth with greater agility, modernize legacy system management, and focus on innovation and newer initiatives. This collaboration also underscores Infosys’s growing footprint in Japan and the ability

Velo3D, Inc., a leading metal additive manufacturing technology company, announced that it will release its second quarter 2026 financial results after the market close on August 11, 2026. The company will host an earnings conference call and webcast to discuss its financial results at 2 p.m. Pacific Time / 5 p.m. Eastern Time the same day. The U.S. dial-in for the call is 877-704-2771 and 201-689-8732 for non-U.S. callers. Please ask to be joined to the Velo3D call. The live webcast of the call can be accessed from the Events page of the Investor Relations section of Velo3D's website at ir.velo3d.com, along with the company's earnings press release and presentation which will be posted prior to the start of the conference call. To view the original press release, please click here. Search for Velo3D on CIMdata.com

Keysight Technologies, Inc. will release financial results for the fiscal third quarter ending July 31, 2026, after the close of the stock market on Tuesday, August 18, 2026. The company will host a conference call to discuss the results at 1:30 p.m. PT (4:30 p.m. ET) the same day. To join the audio webcast, click the link on the Upcoming Events section of the Keysight Investor Relations website, investor.keysight.com. A recording of the call will also be available on the website for 90 days in the News, Events, Presentations section. To view the original press release, please click here. Search for Keysight Technologies on CIMdata.com

IFS, the leading provider of Industrial AI software, delivered 25% year-on-year ARR growth in H1 2026, demonstrating customers increasingly adopting and scaling Industrial AI across their operations. The results reflect strong revenue growth, customer expansion, and rising demand for AI-powered solutions that deliver measurable outcomes. Increased adoption of industry-specific AI use cases is a key driver of IFS's continued growth, as more industrial organizations seek to apply AI to complex operational challenges across manufacturing, asset maintenance, supply chain, field service and warehouse operations. IFS is helping to deploy AI in real-world operational environments, generating tangible improvements in productivity, efficiency, and decision-making. Innovation driving customer outcomes IFS expanded its Industrial AI capabilities during H1 2026, including:  IFS Nexus Black's Resolve: Transforms field service operations globally using AI to predict faults and reduce downtime, enabling busy technicians to resolve issues faster. IFS Zero: Reduces emissions data collection effort by up to 30%. IFS Loops Agentic Platform: Enables enterprises to create

Second quarter 2026 - Operating net sales of 1,050.2 MEUR (1,010.5) resulting in organic growth of 12% - Net sales including acquired deferred revenue amounted to 1,050.2 MEUR (1,009.8) - Adjusted gross earnings of 654.3 MEUR (646.5) resulting in a 62.3% (64.0) gross margin - EBITAC of 255.1 MEUR (225.5), corresponding to a 24.3% (22.3%) EBITAC margin - EBIT1 of 272.0 MEUR (260.0) resulting in a 25.9% (25.7) EBIT1 margin - Adjusted earnings per share of 7.8 Euro cent (6.9) - Earnings per share of 9.2 Euro cent (6.3) - Cash conversion (of EBITAC, incl. Robotics) of 149% (124) - Recurring revenue of 269.3 MEUR (317.9), 4% organic growthFor further information, please contact:  Tom Hull, Head of Investor Relations, Hexagon AB, +44 7442 678 437,  \n This email address is being protected from spambots. You need JavaScript enabled to view it. This is information that Hexagon AB is obliged to make

Contruent, a leading SaaS provider of lifecycle cost management solutions for capital projects, participated as an Industry Partner at the 7th Edition of Infraday Midwest, held July 20-21, 2026, at Chicago’s Old Post Office. The conference brought together public agencies, utilities, transportation leaders, contractors, infrastructure investors, and technology companies to discuss the future of infrastructure investment across the Midwest. Infraday Midwest is recognized for bringing together the leaders responsible for planning, funding, and delivering major infrastructure programs. Contruent’s participation reflects its commitment to helping owner organizations improve project controls and deliver complex capital programs with greater confidence.  Christy Hunt, Product Marketing Manager at Contruent, moderated two featured panel discussions. She opened the conference with “The Midwest Infrastructure Supercycle: AI, Manufacturing & Industrial Load Growth,” which explored how rising demand for power, manufacturing, and industrial development is creating new challenges for infrastructure across the region.  “Across North America, we’re seeing significant investment in infrastructure, energy, transportation, and industrial projects,” said Jason Rupert, CEO of

DXC Technology, a leading enterprise technology and innovation partner, announced a strategic partnership with ElevenLabs, the AI company specializing in audio models and voice agents. The collaboration will accelerate DXC’s AI-first transformation strategy by embedding advanced voice AI capabilities across its internal operations and customer solutions. DXC also announced it participated in ElevenLabs’ recent $500 million Series D funding round, valuing the company at approximately $11 billion. As part of this partnership, DXC will embed advanced voice AI capabilities across its global enterprise environment, enhancing employee productivity, modernizing customer engagement, and enabling new AI-driven service offerings. Advancing DXC’s AI Fast Track Strategy The partnership also aligns with DXC’s Fast Track innovation agenda, focused on scaling next-generation AI, SaaS, and platform-led solutions across industries. By integrating ElevenLabs’ capabilities, DXC will strengthen its ability to deliver differentiated, human-like digital experiences at scale, with these capabilities extending to global clients across key areas: Enterprise Productivity & Digital

Synopsys, Inc. announced new autonomous agentic AI workflows for chip design, developed in collaboration with Microsoft and available for evaluation on Microsoft Discovery. AI is fundamentally reshaping engineering, and Synopsys is building a comprehensive, open agentic AI stack to increase engineering autonomy and accelerate product design from silicon to systems. This week at the 2026 DAC Chips to Systems Conference, Synopsys is showcasing new fully autonomous workflows powered by AgentEngineer™ technology, extending agentic AI from task automation to long-running engineering execution. This includes Synopsys autonomous workflows on Microsoft Discovery: Synopsys fully-autonomous debug closure workflow: A fully autonomous AI-powered verification and root cause analysis (RCA) workflow orchestrated with Microsoft Discovery, brings together domain-specific and task-level agents to identify design failures, automate debug tasks, and accelerate validation— helping engineering teams resolve issues faster and improve silicon quality. Early evaluations show reductions of 25–40% in debug cycle time, saving many weeks of engineering efforts and improving productivity. Synopsys fully-autonomous implementation and closure

Siemens announced that its Calibre® nmPlatform tool for integrated circuit (IC) design verification and its Solido™ Simulation Suite for analog, custom digital and mixed-signal circuit verification, are now certified for Intel 14A and Intel 18A-P process technologies. The Calibre® nmPlatform software certifications for Intel’s processes include Calibre nmDRC, Calibre nmLVS, Calibre PERC and Calibre YieldEnhancer product lines. In addition to the certification of Solido SPICE and Analog FastSPICE (AFS), both part of Solido Simulation Suite software, they are now enabled with Open Model Interface (OMI), the industry-standard platform for aging modeling and reliability analysis. Further, AFS is now enabled through Intel’s Custom Reference Flow (CRF). Siemens and Intel Foundry have also collaborated to provide a digital workflow for Intel's advanced packaging technologies, including Embedded Multi-die Interconnect Bridge (EMIB) and Embedded Multi-die Interconnect Bridge-T (EMIB-T) featuring through-silicon vias (TSV). This enables engineers to seamlessly design, prototype and verify multi-chiplet architectures, using a comprehensive