Optomec announced today that the company will feature its production grade Aerosol Jet 3D Printers at the International Microelectronics Assembly and Packaging Society (iMAPS) Advanced Technology Workshop on Additive Manufacturing and Printed Electronics. The Workshop will be held at the University of Massachusetts Lowell Inn and Conference Center in Lowell, MA this week. Dr. Mike Renn, Optomec Chief Technology Officer, will serve as chair for the session on Materials and Printing, and Dr. Kurt Christenson, Optomec Senior Scientist, will give a presentation titled “Micrometer-Scale 3D Printed Electronics” The company will also highlight Aerosol Jet printers in the exhibit area.
Dr. Christenson will explain how Aerosol Jet is a non-contact printing technique capable of patterning a wide variety of electronic and polymeric materials at the micrometer size scale. In the jetting process, a liquid ink is aerosolized and the mist is aerodynamically focused to a micron-scale point on the target substrate. The large standoff distance between the Aerosol Jet tools printing tip and the substrate (>5 mm) enables the additional capability of manipulating jetted particles during their flight to the substrate. With robotic manipulation of the print head and target substrate, the 3D features can be fabricated in nearly any orientation including the fabrication of hollow structures such as microbubbles. Dr. Christenson’s presentation will also explain how co-depositing electronic and polymeric materials makes it possible to fabricate hybrid electronics. In this case the polymeric materials serve as the mechanical support for printed metal conductors and other electronic materials. Examples of embedding circuits into 3D products, including sensors, RF antenna, and power sources will be discussed.
Printing technology is expected to enable the evolution of electronics from rigid boards to products that are flexible, conformal or wearable. The iMAPS workshop will bring together experts to report on the progress and the challenges of this emerging field. This technology is expected to impact the options for integration of active and passive components and will exploit additive approaches to advance microelectronic packaging. Conference sessions will cover the development of printable electronic materials (inks), the options for manufacturing/printing and the applications of printed and flexible electronics.
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